Dynamic random access memory and method of fabricating the same
A dynamic random access memory and a method of fabricating the same are provided. The dynamic random access memory includes a substrate, an isolation structure, a buried word line structure, and a plurality of a first fin structures. The isolation structure is disposed in the substrate and defines a plurality of active regions arranged in a column in a first direction. The buried word line structure is located in the substrate and extended along the first direction and across the plurality of active regions and the isolation structure. The plurality of first fin structures is located in an intersecting region of the plurality of active regions and the buried word line structure, arranged in a column along the first direction, and surrounded and covered by the buried word line structure.
1. A dynamic random access memory, comprising:
a substrate including a gate trench;
an isolation structure located in the substrate, wherein the isolation structure defines a plurality of active regions arranged in a column along a first direction;
a buried word line structure located in the substrate and partially filling the gate trench, wherein the buried word line structure extends along the first direction and across the plurality of active regions and the isolation structure;
a plurality of first fin structures located in an intersecting region of the active regions and the buried word line structure, wherein the plurality of first fin structures are arranged in a column along the first direction and surrounded and covered by the buried word line structure; and
a dielectric layer disposed on the substrate, filling the gate trench and covering the buried word line structure.
2. The dynamic random access memory of claim 1 , wherein the buried word line structure comprises a conductive layer, and the plurality of first fin structures is surrounded and covered by the conductive layer.
3. The dynamic random access memory of claim 2 , wherein the buried word line structure further comprises a plurality of insulation structures located between the plurality of first fin structures and the substrate.
4. The dynamic random access memory of claim 3 , wherein the conductive layer of the buried word line structure covers a surface and a sidewall of the plurality of first fin structures and a sidewall of the plurality of insulation structures.
5. The dynamic random access memory of claim 1 , further comprising a plurality of second fin structures located below the plurality of first fin structures, wherein the plurality of first fin structures and the plurality of second fin structures are both located in the buried word line structure and surrounded and covered by the buried word line structure.
6. A dynamic random access memory, comprising:
a substrate, wherein the substrate has a first word line tunnel; and
a first buried gate structure located in the substrate above the first word line tunnel and separated from the first word line tunnel, wherein a sidewall and a bottom surface of the first buried gate structure are covered by the substrate, and a top surface of the first buried gate structure is covered by a dielectric layer; and
a dielectric material layer at least covering a surface of the first word line tunnel.
7. The dynamic random access memory of claim 6 , further comprising a conductive layer located in the first word line tunnel, wherein the dielectric material layer is a gate dielectric layer and forms a second buried gate structure with the conductive layer.
8. The dynamic random access memory of claim 6 , wherein the dielectric material layer is completely filled in the first word line tunnel as an insulation structure.
9. The dynamic random access memory of claim 7 , wherein the substrate further has a second word line tunnel located below the first word line tunnel, and the second word line tunnel and the first word line tunnel are not connected to each other.
10. The dynamic random access memory of claim 9 , further comprising a third buried gate structure located in the second word line tunnel and surrounded and covered by the substrate, wherein in the substrate, the first buried gate structure, the second buried gate structure, and the third buried gate structure are arranged from top to bottom.