Methods of forming memory cells
View Patent ↗Some embodiments include methods of forming memory cells. Heater structures are formed over an array of electrical nodes, and phase change material is formed across the heater structures. The phase change material is patterned into a plurality of confined structures, with the confined structures being in one-to-one correspondence with the heater structures and being spaced from one another by one or more insulative materials that entirely laterally surround each of the confined structures. Some embodiments include memory arrays having heater structures over an array of electrical nodes. Confined phase change material structures are over the heater structures and in one-to-one correspondence with the heater structures. The confined phase change material structures are spaced from one another by one or more insulative materials that entirely laterally surround each of the confined phase change material structures.
1. A method of forming memory cells, comprising:
forming a plurality of heater structures over an array of electrical nodes; the array of electrical nodes having rows extending along a first direction and having columns extending along a second direction substantially orthogonal to the first direction; wordlines being under the electrical nodes and extending along the first direction;
forming a phase change material across the plurality of heater structures;
patterning the phase change material into a plurality of confined structures; the plurality of confined structures being spaced from one another by one or more insulative materials that entirely laterally surround each of the confined structures in the plurality of confined structures; each confined structure of the plurality of confined structures being associated with only a single memory cell; and
forming bitlines across the plurality of confined structures, with the bitlines extending along the second direction; and
wherein the plurality of heater structures are patterned from lines of heater material that extend along the first direction; and wherein the patterning of the phase change material into the plurality of confined structures and the patterning of the lines of heater material into the plurality of heater structures comprises forming a lattice of trenches; the trenches punching through the phase change material and the lines of heater material to simultaneously form the plurality of confined structures and the plurality of heater structures.
2. The method of claim 1 further comprising lining the lattice of trenches with an insulative material of the one or more insulative materials.
3. The method of claim 1 further comprising lining the lattice of trenches with a non-oxygen-containing insulative material of the one or more insulative materials.
4. The method of claim 1 further comprising forming additional conductive material over the bitlines.
5. The method of claim 4 further comprising patterning the additional conductive material into lines directly over and along the bitlines.
6. The method of claim 1 wherein the forming the bitlines comprises forming a bitline material over a planar surface, forming a patterned mask over the bitline material and transferring the pattern into the bitline material to form patterned bitlines.
7. The method of claim 6 wherein the forming the patterned mask comprises pitch-multiplication.