Electroless deposition of metal on 3D-printed polymeric structures
View Patent ↗A process for metallizing a three-dimensional-printed polymeric structure includes soaking the three-dimensional-printed polymeric structure in a metal salt solution; transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent; soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure. A metal plated porous structure and an apparatus for improving metallization are also disclosed.
1. A process for metallizing a three-dimensional-printed polymeric structure comprising:
soaking the three-dimensional-printed polymeric structure in a metal salt solution;
transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent;
soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure;
wherein the polymeric structure comprises a polymer selected from the group consisting of: polycarbonate, acrylonitrile butadiene styrene copolymer, acrylonitrile-styrene-acrylate copolymer, and poly(methyl methacrylate).
2. The process of claim 1 , wherein the first reducing agent is a borohydride with an alkali or alkaline earth metal compound.
3. The process of claim 1 , wherein the pH buffer comprises ammonia and ammonium chloride.
4. The process of claim 1 , wherein the second reducing agent comprises hydrazine.
5. The process of claim 1 , wherein the coordinating agent includes ammonia, the pH buffer includes ammonia and ammonium chloride, and the second reducing agent includes hydrazine.
6. The process of claim 1 , wherein the second reducing agent reduces the palladium or platinum at a lower rate than the first reducing agent.
7. The process of claim 1 , further comprising the step of three dimensional printing the three-dimensional-printed polymeric structure, wherein the printing step is performed by an automatic extruding process.
8. The process of claim 1 , wherein the polymeric structure consists of a polymer selected from the group consisting of: polycarbonate, acrylonitrile butadiene styrene copolymer, acrylonitrile-styrene-acrylate copolymer, and poly(methyl methacrylate).
9. The process of claim 1 , wherein the first soaking step oxidizes the surface of the three-dimensional polymeric structure.
10. The process of claim 1 , wherein the metal of the metal salt is selected from palladium, platinum, nickel, copper, gold, silver, and rhodium, or combinations of any of these.
11. The process of claim 1 , wherein nanoparticles of the metal of the metal salt are formed on a surface of the three-dimensional polymeric structure.
12. The process of claim 1 , wherein the metal salt solution includes water and a water-soluble organic cosolvent.
13. The process of claim 12 , wherein the plating solution comprises a water-soluble, polar organic solvent.
14. The process of claim 1 , wherein the further comprising applying pressure or vacuum to force the metal salt solution into contact with the three-dimensional polymeric structure.
15. The process of claim 14 , wherein the three-dimensional polymeric structure includes at least a portion of a lattice with pore sizes of 5 micrometers to 1000 micrometers.
16. The process of claim 15 , wherein, following the metal plating bath step, at least 98% of the three-dimensional polymeric structure is covered with metal.