Method for integrated circuit patterning
A method includes patterning a resist layer formed over a substrate, resulting in a resist pattern; and transferring the resist pattern to an anti-reflection coating (ARC) layer formed under the resist layer and over the substrate, resulting in a patterned ARC layer. The method further includes treating the patterned ARC layer with an ion beam, resulting in a treated patterned ARC layer, wherein the ion beam is generated with a first gas and is directed towards the patterned ARC layer at a tilt angle at least 10 degrees. The method further includes etching the substrate with the treated patterned ARC layer as an etch mask.
1. A method, comprising:
patterning a resist layer formed over a substrate, resulting in a resist pattern;
transferring the resist pattern to an anti-reflection coating (ARC) layer formed under the resist layer and over the substrate by etching the ARC layer, resulting in a patterned ARC layer, wherein the patterned ARC layer includes a line pattern;
after the transferring of the resist pattern to the ARC layer, treating the patterned ARC layer with an ion beam, resulting in a treated patterned ARC layer, wherein the ion beam is generated with a first gas and is directed towards the patterned ARC layer at a tilt angle at least 10 degrees; and
etching the substrate with the treated patterned ARC layer as an etch mask.
2. The method of claim 1 , further comprising:
treating the resist pattern with the ion beam before transferring the resist pattern to the ARC layer.
3. The method of claim 1 , wherein the ion beam is directed towards the patterned ARC layer at twist angles having a unimodal distribution from about −50 degrees to about 50 degrees, wherein the twist angle of the ion beam is an angle between a first plane and a second plane, the first plane containing the ion beam and a first axis perpendicular to a top surface of the ARC layer and the second plane containing the first axis and a second axis being the widthwise direction of the line pattern.
4. The method of claim 1 , wherein the ion beam is directed towards the patterned ARC layer at twist angles having a bimodal distribution with one ion energy peak at about 12.5 degrees and another ion energy peak at about −12.5 degrees, wherein the twist angle of the ion beam is an angle between a first plane and a second plane, the first plane containing the ion beam and a first axis perpendicular to a top surface of the ARC layer and the second plane containing the first axis and a second axis being the widthwise direction of the line pattern.
5. The method of claim 1 , wherein the first gas is Ar and the ion beam is provided with ion energy from about 1.0 ke V to about 3.5 ke V and ion dose from about 1×1016 ions/cm2 to about 10×1016 ions/cm2.
6. The method of claim 1 , wherein the first gas is He and the ion beam is provided with ion energy from about 1 ke V to about 5 ke V and ion dose from about 1×1016 ions/cm2 to about 10×1016 ions/cm2.
7. The method of claim 1 , wherein the first gas is SiH4 and the ion beam is provided with ion energy from about 2 ke V to about 5 ke V and ion dose from about 0.5×1016 ions/cm2 to about 3×1016 ions/cm2.
8. The method of claim 1 , wherein the first gas is CH4 and the ion beam is provided with ion energy from about 1 ke V to about 5 ke V and ion dose from about 1×1016 ions/cm2 to about 6×1016 ions/cm2.
9. The method of claim 1 , wherein the etching of the substrate with the treated patterned ARC layer results in a patterned material layer over the substrate, further comprising:
treating the patterned material layer with the ion beam.
10. The method of claim 1 , further comprising removing the treated patterned ARC layer.
11. A method, comprising:
forming a bottom material layer over a substrate;
forming an anti-reflection coating (ARC) layer over the bottom material layer;
forming a resist layer over the ARC layer;
patterning the resist layer, resulting in a patterned resist layer;
performing ion implantation to the patterned resist layer, resulting in a treated patterned resist layer, wherein the performing of the ion implantation comprises:
providing a treatment gas containing CH4, SiH4, Ar, or He;
generating an ion beam from the treatment gas; and
directing the ion beam incident upon the patterned resist layer at a tilt angle of at least 10 degrees;
etching the ARC layer with the treated patterned resist layer as an etch mask, resulting in a patterned ARC layer, wherein the patterned ARC layer includes a line pattern; and
performing another ion implantation to the patterned ARC.
12. The method of claim 11 , wherein the ion beam has an ion dose of at least 0.5×1016 ions/cm2.
13. The method of claim 11 , wherein the ion beam is directed incident upon the substrate at twist angles having a unimodal distribution, wherein the twist angle of the ion beam is an angle between a first plane and a second plane, the first plane containing the ion beam and a first axis perpendicular to a top surface of the ARC layer and the second plane containing the first axis and a second axis being the widthwise direction of the line pattern.
14. The method of claim 11 , wherein the ion beam is directed incident upon the substrate at twist angles having a bimodal distribution, wherein the twist angle of the ion beam is an angle between a first plane and a second plane, the first plane containing the ion beam and a first axis perpendicular to a top surface of the ARC layer and the second plane containing the first axis and a second axis being the widthwise direction of the line pattern.
15. The method of claim 14 , wherein the bimodal distribution comprises two unimodal distributions substantially limited within ranges from −17.5 degrees to −7.5 degrees and from 7.5 degrees to 17.5 degrees.
16. The method of claim 11 , after performing the ion implantation to the patterned ARC layer, further comprising:
etching the bottom material layer with the patterned ARC layer as an etch mask, resulting in a patterned bottom material layer; and
performing the ion implantation to the patterned bottom material layer.
17. A method, comprising:
patterning by etching a material layer over a substrate, the material layer being other than a resist layer, resulting in a patterned material layer having at least a line pattern;
treating the patterned material layer with an ion beam generated with one of: CH4, SiH4, Ar, and He, and directed incident upon the substrate at a tilt angle greater than 10 degrees, resulting in a treated patterned material layer; and
etching the substrate with the treated patterned material layer as a mask.
18. The method of claim 17 , wherein the material layer is a silicon-containing anti-reflection coating (ARC) layer.
19. The method of claim 17 , wherein the material layer contains silicon, carbon, and oxygen.
20. The method of claim 17 , wherein the ion beam has a bimodal distribution of twist angles, the bimodal distribution comprising two unimodal distributions substantially limited within ranges from −17.5 degrees to −7.5 degrees and from 7.5 degrees to 17.5 degrees, wherein the twist angle of the ion beam is an angle between a first plane and a second plane, the first plane containing the ion beam and a first axis perpendicular to a top surface of the ARC layer and the second plane containing the first axis and a second axis being the widthwise direction of the line pattern.