Flame retardant laser direct structuring materials
View Patent ↗Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.
1. A thermoplastic composition, comprising:
a) from 70 to 85 wt % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyamide resin;
b) from 0.5 to 15 wt % by weight of a laser direct structuring additive, wherein the laser direct structuring additive is a copper chromium oxide spinel; and
c) 0.1 to 15 wt % of a flame retardant, wherein the flame retardant comprises resorcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), or a combination thereof;
wherein amounts are based on a total weight of the thermoplastic composition,
wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.6 mm (±10%), and
wherein laser activation of an area of the thermoplastic composition exposes and activates metal atoms of the laser direct structuring additive such that a metal plating layer can be plated on the area activated by the laser.
2. The composition of claim 1 , wherein the polyamide resin comprises polyamide-6, polyamide-6,6, polyamide-4,6, polyamide-11, polyamide-12, polyamide-6,10, polyamide-6,12, polyamide 6/6,6, polyamide-6/6,12, polyamide MXD,6, polyamide-6,T, polyamide-6,I, polyamide-6/6,T, polyamide-6/6,I, polyamide-6,6/6,T, polyamide-6,6/6,I, polyamide-6/6,T/6,I, polyamide-6,6/6,T/6,I, polyamide-6/12/6,T, polyamide-6,6/12/6,T, polyamide-6/12/6,I, polyamide-6,6/12/6,I, or a combination comprising at least one of the foregoing polyamide resins.
3. The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.2 mm (±10%).
4. The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.0 mm (±10%).
5. The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 0.8 mm (±10%).
6. The composition of claim 1 , wherein the thermoplastic composition includes from 10 to 15 wt. % of the flame retardant, and the flame retardant comprises resorcinol bis(diphenyl phosphate).
7. An article of manufacture comprising the composition of claim 1 .
8. The article of claim 7 , wherein the article is selected from a personal computer, a notebook computer, a portable computers, a cell phone, or a personal digital assistant.
9. A method of forming a thermoplastic composition comprising the step of: blending in an extruder:
a) from 70 to 85 wt % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyamide resin;
b) from 0.5 to 15 wt % of a laser direct structuring additive, wherein the laser direct structuring additive is a copper chromium oxide spinel; and
c) 0.1 to 15 wt % of a flame retardant, wherein the flame retardant comprises resorcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), or a combination thereof;
wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.6 mm (±10%), and
wherein laser activation of an area of the thermoplastic composition exposes and activates metal atoms of the laser direct structuring additive such that a metal plating layer can be plated on the area activated by the laser.
10. The method of claim 9 , wherein the polyamide resin comprises polyamide-6, polyamide-6,6, polyamide-4,6, polyamide-11, polyamide-12, polyamide-6,10, polyamide-6,12, polyamide 6/6,6, polyamide-6/6,12, polyamide MXD,6, polyamide-6,T, polyamide-6,I, polyamide-6/6,T, polyamide-6/6,I, polyamide-6,6/6,T, polyamide-6,6/6,I, polyamide-6/6,T/6,I, polyamide-6,6/6,T/6,I, polyamide-6/12/6,T, polyamide-6,6/12/6,T, polyamide-6/12/6,I, polyamide-6,6/12/6,I, or a combination comprising at least one of the foregoing polyamide resins.
11. The method of claim 9 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.2 mm (±10%).
12. The method of claim 9 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.0 mm (±10%).
13. The method of claim 9 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 0.8 mm (±10%).
14. The method of claim 9 , wherein the thermoplastic composition includes from 10 to 15 wt. % of the flame retardant, and the flame retardant comprises resorcinol bis(diphenyl phosphate).