Mechatronic component and method for the production thereof
The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side. A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.
1. A mechatronic assembly of a gear control arrangement, the mechatronic assembly comprising:
a supporting circuit board having at least one populated flat side;
an electric circuit arrangement positioned on the at least one populated flat side, the electric circuit arrangement comprising an electronic assembly;
a first mechanical insert part arranged on the at least one populated flat side, the first mechanical insert part designed as a hybrid injection-molded part and comprising a metallic carrier for making electrical contact and mechanically securing a first sensor on the supporting circuit board;
a second mechanical insert part designed as a bus bar connecting, mechanically and in an electrically conductive manner, a second sensor to the supporting circuit board; and
one-piece encapsulation comprising a curable encapsulation material, the one-piece encapsulation surrounding in a form-fitting and cohesive manner, all of the components arranged on the populated flat side of the supporting circuit board.
2. The mechatronic assembly of claim 1 , wherein the encapsulation is formed of a curable encapsulation material.
3. The mechatronic assembly of claim 2 , wherein the curable encapsulation material comprises a thermosetting plastic.
4. The mechatronic assembly of claim 2 , wherein the curable encapsulation material incorporates at least one inorganic filler material.
5. The mechatronic assembly of claim 1 , wherein the encapsulation has at least one reinforcing rib.
6. The mechatronic assembly of claim 1 , wherein the encapsulation at least partially encloses a flat side of the supporting circuit board arranged opposite the populated flat side thereof.
7. The mechatronic assembly of claim 1 , further comprising:
an electric circuit arrangement with an electronic assembly; and
at least one sensor.
8. The mechatronic assembly of claim 7 , further comprising a printed circuit board element arranged between the electric circuit arrangement.
9. A method for the production of a mechatronic assembly of a gear control arrangement, the method comprising:
providing a supporting circuit board having at least one flat side that is populated with a plurality of electronic components;
mechanically fixing the at least one electronic component to the flat side of the supporting circuit board by a first mechanical insert part, the first mechanical insert part arranged on the at least one populated flat side, the first mechanical insert part designed as a hybrid injection-molded part and comprising a metallic carrier for making electrical contact and mechanically securing a first sensor on the supporting circuit board;
connecting, mechanically and in an electrically conductive manner a second sensor to the supporting circuit board by a second mechanical insert part designed as a bus bar; and
applying a curable one-piece encapsulation to the plurality of electronic components including the first and second mechanical insert parts which material, upon curing, bonds with the electronic components and the first and second mechanical insert parts in a form-fitting and cohesive manner, and encapsulates the latter in a one-piece arrangement.
10. The method of claim 9 , further comprising:
packing the curable encapsulation material in a mold; and
immersing the supporting circuit board with its populated flat side in the mold.
11. The method of claim 9 , further comprising spraying the curable encapsulation material onto the populated flat side of the supporting circuit board.