Solid-state imaging device and imaging apparatus
The present technique relates to a solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior color separation and high sensitivity.
1. A imaging device, comprising:
a first photoelectric conversion region disposed in a semiconductor substrate;
a first gate of a first transistor, a part of the first gate of the first transistor being disposed in the semiconductor substrate, overlapping the first photoelectric conversion region in a depth direction in a cross-sectional view, and comprising a first end disposed at a first surface of the semiconductor substrate; and
a second gate of a second transistor, a part of the second gate of the second transistor being disposed in the semiconductor substrate, overlapping the first photoelectric conversion region in a width direction in a cross-sectional view, and comprising a second end disposed at the first surface of the semiconductor substrate,
wherein a second surface of the semiconductor substrate opposite to the first surface of the semiconductor substrate is a light incident side.
2. The imaging device according to claim 1 , wherein the first transistor is a transfer transistor.
3. The imaging device according to claim 1 , wherein the second transistor is a transfer transistor.
4. The imaging device according to claim 1 , wherein the part of the first gate of the first transistor disposed in the semiconductor substrate comprises a third end in contact with the first photoelectric conversion region.
5. The imaging device according to claim 4 , wherein the part of the second gate of the second transistor disposed in the semiconductor substrate comprises a fourth end, the fourth end being disposed at a position in a depth direction approximately the same as the third end of the part of the first gate of the first transistor disposed in the semiconductor substrate.
6. The imaging device according to claim 1 , further comprising a first floating diffusion disposed adjacent to the first end of the first gate of the first transistor and a second floating diffusion disposed adjacent to the second end of the second gate of the second transistor.
7. The imaging device according to claim 1 , further comprising a read out circuit disposed above the first surface of the semiconductor substrate.
8. The imaging device according to claim 1 , wherein the first photoelectric conversion region is configured to be sensitive to blue light.
9. The imaging device according to claim 1 , further comprising a light shielding film disposed above the second surface of the semiconductor substrate.
10. The imaging device according to claim 1 , further comprising a second photoelectric conversion region disposed between the first photoelectric conversion region and the first surface of the semiconductor substrate.
11. The imaging device according to claim 10 , wherein the second photoelectric conversion region is configured to be sensitive to red light.
12. The imaging device according to claim 10 , wherein the second photoelectric conversion region is disposed between the first gate of the first transistor and the second gate of the second transistor.
13. An electronic apparatus, comprising:
an optical system;
a signal processing circuit, and
an imaging device, the imaging device, comprising:
a first photoelectric conversion region disposed in a semiconductor substrate;
a first gate of a first transistor, a part of the first gate of the first transistor being disposed in the semiconductor substrate, overlapping the first photoelectric conversion region in a depth direction in a cross-sectional view, and comprising a first end disposed at a first surface of the semiconductor substrate; and
a second gate of a second transistor, a part of the second gate of the second transistor being disposed in the semiconductor substrate, overlapping the first photoelectric conversion region in a width direction in a cross-sectional view, and comprising a second end disposed at the first surface of the semiconductor substrate,
wherein a second surface of the semiconductor substrate opposite to the first surface of the semiconductor substrate is a light incident side.