METHOD AND APPARATUS FOR DERMATOLOGICAL TREATMENT
Exemplary methods and systems can be provided for resurfacing of skin that include formation of a plurality of small holes, e.g., having widths greater than about 0.2 mm and less than about 0.7 mm or 0.5 mm, using a mechanical apparatus. Compressive and/or tensile forces can then be applied to the treated region of skin as the damage heals to facilitate hole closure, and provide enhanced and/or directional shrinkage of the treated skin area.
1 . A cosmetic method for producing an effect in skin, tissue, comprising:
forming a plurality of holes in a region of the skin tissue using at least one coring needle; and
providing a stress that is at least one of a compressive stress or a tensile stress in the region of skin tissue after forming the holes,
wherein a diameter of the holes is between 0.2 mm and 0.7 mm,
wherein the holes extend from the skin surface into the dermal layer of the skin, wherein the holes extend over an areal fraction of a surface of the region that is between 5% and 50%,
wherein the stress provides a force in the region, along a direction that is parallel, to the surface of the region, and
wherein the stress is maintained on the surface of the region until the holes have closed.
2 . The method of claim 1 , wherein a diameter of the holes is between 0.2 mm and 0.5 mm.
3 . The method of claim 1 , wherein the holes ex tend over the areal fraction of the surface of the region that is between 10% and 30%.
4 . The method of claim 1 , wherein the holes extend through an. entire depth of the dermal layer.
5 . The method of claim 1 , wherein the stress is the compressive stress which is provided by adhering a pre-stretched film over at least one portion of the region,
6 . The method of claim 5 , further comprising adhering a rigid object onto the pre-stretched. film after the pre-stretched film has been adhered to the at least one portion of the region.
7 . The method of claim 6 , wherein the rigid object is at least one of a rigid film or a plate.
8 . The method of claim 1 wherein the stress is the compressive stress that is provided by inserting at least one of a surgical staple or a tensioning clip into or adjacent to the region.
9 . The method of claim 1 wherein the stress is the compressive stress, which is provided by inserting at least one suture into or adjacent to the region.
10 . The method of claim 1 , wherein the stress is the compressive stress, which is provided by adhering a heat-shrink film onto at least, a portion of the region and then heating the heat-shrink film.
11 . The method of claim 1 , wherein the stress is the compressive stress, which is provided by applying a curable liquid onto at least a portion of the region and allowing the liquid to cure, wherein the curable liquid is a liquid that shrinks when curing.
12 . The method of claim 1 , wherein the stress is the tensile stress, which is provided by stretching at least a portion of the region and then adhering a rigid object onto the stretched region.
13 . The method of claim 12 , wherein the rigid object is at least one of a rigid film or a plate,
14 . The method of claim 5 , wherein the stress is maintained for at least 4 days.
15 . The method of claim 1 , further comprising applying at least one of a biological glue or an adhesive to at least, one portion of the region after forming the holes, and maintaining the stress until the glue or the adhesive has at least partially set.
16 . The method of claim 15 further comprising applying a photoactivated substance to at least one portion of the region, and directing light energy onto the region while maintaining the stress until the adhesive has been activated.
17 . The method of claim 16 , wherein the photoactivated adhesive comprises at least one of rose bengal riboflavin, a porphyrin, a chlorine, or a photosensitizer precursor.
18 .- 24 . (canceled)
25 . The method of claim 8 , wherein the stress is maintained for at least 4 days.
26 . The method of claim 9 , wherein the stress is maintained for at least 4 days.
27 . The method of claim 10 , wherein the stress is maintained for at least 4 days.