Integrated structures and methods of forming integrated structures
View Patent ↗Some embodiments include an integrated structure having a first opening extending through a stack of alternating insulative levels and conductive levels. A nitride structure is within the first opening and narrows the first opening to form a second opening. Detectable oxide is between the nitride structure and one or more of the conductive levels. Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. A first opening extends through the vertically-stacked levels to the conductive material and has opposing sidewalls along a cross-section. Nitride liners are along the sidewalls of the first opening. Detectable oxide is between at least one of the nitride liners and one or more of the vertically-stacked conductive levels. Some embodiments include methods for forming integrated structures.
1. A method of forming an integrated structure, comprising:
forming an assembly comprising a conductive material, a select device gate material over the conductive material and spaced from the conductive material by an insulative material, and a stack over the select device gate material and comprising alternating insulative levels and conductive levels;
forming a first opening to extend through the stack, through the select device gate material, through the insulative material and to the conductive material; the first opening having opposing sidewalls along a cross-section; the formation of the first opening generating conductive stringers along one or both of the opposing sidewalls of the first opening;
oxidizing the conductive stringers to convert them to insulative oxide; and
forming nitride liners along the opposing sidewalls of the first opening and over the insulative oxide, the nitride liners narrowing the first opening to form a second opening.
2. The method of claim 1 wherein the oxidation of the conductive stringers utilizes in situ steam generation.
3. The method of claim 2 wherein the in situ steam generation utilizes O 2 and a temperature in excess of 700° C.
4. The method of claim 2 wherein the in situ steam generation utilizes H 2 , O 2 and a temperature in excess of 700° C.
5. The method of claim 2 comprising filling the second opening with one or more insulative compositions.
6. The method of claim 2 comprising filling the second opening with silicon dioxide.