Compact integrated device packages

1. An integrated device package comprising:

a package substrate;

a first integrated device die mounted to the package substrate;

a second integrated device die mounted to the package substrate, the first integrated device die spaced from the second integrated device die on the package substrate along a longitudinal axis, the first and second integrated device dies angled relative to one another about the longitudinal axis by a fixed non-parallel angle in a transverse plane non-parallel to the longitudinal axis;

a molding material at least partially disposed over the package substrate between the first and second integrated device dies to maintain the fixed non-parallel angle; and

a bracket assembly extending along a longitudinal axis serving as a stiffener for the first and second integrated device dies.

2. The package of claim 1 , wherein the package substrate comprises a twisted section disposed between the first and second integrated device dies, the molding material disposed over at least a portion of the twisted section.

3. The package of claim 1 , wherein the package substrate comprises a flexible insulating sheet with embedded conductors.

4. The package of claim 1 , wherein the first and second integrated device dies comprise sensor dies.

5. The package of claim 4 , wherein the first and second integrated device dies comprise magnetoresistance sensors, the magnetoresistance sensors comprising at least one of anisotropic magnetoresistance (AMR) sensors, tunneling magnetoresistance (TMR) sensors, and giant magnetoresistance (GMR) sensors.

6. The package of claim 5 , wherein the first integrated device die is configured to sense a position of the package along first and second orthogonal axes, and wherein the second integrated device die is configured to sense the position of the package along a third axis orthogonal to the first and second axes.

7. The package of claim 5 , further comprising a third integrated device die mounted to the package substrate, the third integrated device die configured to process position data transduced by the first and second integrated device dies.

8. The package of claim 7 , wherein the third integrated device die is an analog-to-digital converter (ADC).

9. The package of claim 7 , wherein the third integrated device die is stacked over the second integrated device die.

10. The package of claim 1 , wherein one or more of the first and second integrated device dies is flip chip mounted or wire bonded to the package substrate.

11. The package of claim 1 , wherein a length of the integrated device package along the longitudinal axis is in a range of 3 mm to 15 mm, and the package has a width along a transverse axis that is perpendicular to the longitudinal axis, the width being in a range of 50 microns to 600 microns.

12. The package of claim 1 , wherein the fixed non-parallel angle is formed by a twisted section of the package substrate, and the fixed non-parallel angle is in a range of 89° to 91°.

13. An integrated device package comprising:

a package substrate;

a first integrated device die mounted to the package substrate;

a second integrated device die mounted to the package substrate, the first integrated device die spaced from the second integrated device die on the package substrate along a longitudinal axis, the first and second integrated device dies angled relative to one another about the longitudinal axis by a fixed non-parallel angle in a transverse plane non-parallel to the longitudinal axis,

wherein the integrated device package has a width along a transverse axis that is perpendicular to the longitudinal axis, the width being in a range of 50 microns to 600 microns; and

a bracket assembly extending along a longitudinal axis and serving as a stiffener for the first and second integrated device dies.

14. The package of claim 13 , further comprising a molding material that fixes the fixed non-parallel angle.

15. The package of claim 13 , wherein the first and second integrated device dies comprise sensor dies.