Vertical transistors having improved gate length control
Embodiments of the invention form a channel fin across from a major surface of a substrate, wherein a top surface of the channel fin extends substantially horizontally with respect to the major surface. A gate is formed across from the major surface and along a sidewall surface of the channel fin, wherein a first top surface of the gate is above the top surface of the channel fin and extends substantially horizontally with respect to the major surface. A second top surface of the gate is defined by a trench formed through an exposed sidewall portion of the gate in a direction that is substantially horizontal with respect to the major surface, wherein a gate length dimension of the initial gate is defined by a distance from a bottom surface of the gate to the second top surface of the gate.
1. A semiconductor device comprising:
a channel fin structure comprising a fin-shaped structure formed across from a major surface of a substrate, wherein a top surface of the channel fin structure is substantially parallel with respect to the major surface of the substrate, wherein the channel fin structure comprises sidewalls;
a gate conductor formed across from the major surface of the substrate and along the sidewalls of the channel fin structure, wherein a first top surface of the gate conductor is above the top surface of the channel fin structure and substantially parallel with respect to the major surface of the substrate;
wherein the gate conductor comprises an outer gate conductor sidewall and an inner gate conductor sidewall;
a second top surface of the gate conductor that is substantially parallel with respect to the major surface of the substrate, wherein the second top surface and the inner gate conductor sidewall define a trench formed through an exposed sidewall portion of the gate conductor;
a spacer formed in the trench; and
a top source or drain (S/D) formed on the top surface of the channel fin structure, wherein a top surface of the top S/D is above the first top surface of the gate conductor;
wherein the inner gate conductor sidewall is positioned closer in a horizontal direction to the top S/D than the outer gate conductor sidewall;
wherein a gate length dimension of the gate conductor is defined by a distance from a bottom surface of the gate conductor to the second top surface of the gate conductor.