Substrate treating apparatus, substrate treating method, and plasma generating unit
Disclosed are a substrate treating The substrate treating apparatus includes a plasma generating unit the plasma generating unit includes a plasma generating chamber having a space, into which a gas is introduced, a first antenna wound to surround the plasma generating chamber and connected to a power source through a first electric wire, a second antenna wound to surround the housing and connected to the power source through a second electric wire to be disposed in parallel to the first antenna, and power distributing members provided in the first antenna and the second antenna to distribute electric power supplied from the power source to the first antenna and the second antenna.
1. A substrate treating apparatus comprising:
a housing configured to provide a treatment space, in which a substrate is treated;
a support unit configured to support the substrate in the treatment space; and
a plasma generating unit disposed outside the housing and configured to excite plasma from a gas and supply the excited plasma to the treatment space,
wherein the plasma generating unit includes:
a plasma generating chamber having a space, into which the gas is introduced;
a first antenna wound to surround the plasma generating chamber and connected to a power source through a first electric wire;
a second antenna wound to surround the plasma generating chamber and connected to the power source through a second electric wire to be disposed in parallel to the first antenna; and
power distributing members provided in the first antenna and the second antenna to distribute electric power supplied from the power source to the first antenna and the second antenna,
wherein the first antenna is wound a plurality of times from a first location to a second location, and the second antenna is wound a plurality of times from a third location to a fourth location,
wherein the first location is higher than the second location, and the third location is between the first location and the second location, and
wherein intervals between windings of the first antenna are the same, intervals between windings of the second antenna are the same, and the intervals between the windings of the second antenna are smaller than the intervals of the windings of the first antenna.
2. The substrate treating apparatus of claim 1 , wherein the power distributing members are variable capacitors.
3. The substrate treating apparatus of claim 1 , further comprising:
a matching circuit located in a main electric wire connecting the power source to the first electric wire and the second electric wire.
4. The substrate treating apparatus of claim 1 , wherein the power distributing members include:
a first variable capacitor located in the first electric wire; and
a second variable capacitor located in the second electric wire.
5. The substrate treating apparatus of claim 1 , wherein the fourth location is higher than the second location.
6. The substrate treating apparatus of claim 1 , wherein the second antenna starts to be wound in the same direction as the first antenna with respect to a direction of a circumference of the plasma generating chamber.
7. The substrate treating apparatus of claim 1 , wherein the second antenna starts to be wound at a location that is 180° away from a point at which the first antenna starts to be wound with respect to a direction of a circumference of the plasma generating chamber.
8. The substrate treating apparatus of claim 1 , further comprising:
a controller configured to control the power distributing members such that ignition of plasma is initiated while electric power applied to the first antenna is higher than electric power applied to the second antenna.
9. The substrate treating apparatus of claim 8 , wherein the controller decreases the electric power applied to the first antenna and increases the electric power applied to the second antenna when a preset time period elapses after the ignition of the plasma is initiated.
10. The substrate treating apparatus of claim 8 , wherein the controller controls the power distributing members such that the electric power applied to the first antenna is higher than the electric power applied to the second antenna when a preset time period elapses after the ignition of the plasma is initiated.
11. A substrate treating method comprising:
initiating ignition of plasma by applying electric power, which is higher than electric power applied to a second antenna, to a first antenna; and
when a preset time period elapses after the ignition of the plasma is initiated, decreasing the electric power applied to the first antenna and increasing the electric power applied to the second antenna connected in parallel to the first antenna,
wherein the first antenna is wound a plurality of times from a first location to a second location, and the second antenna is wound a plurality of times from a third location to a fourth location,
wherein the first location is higher than the second location, and the third location is between the first location and the second location, and
wherein intervals between windings of the first antenna are the same, intervals between windings of the second antenna are the same, and the intervals between the windings of the second antenna are smaller than the intervals of the windings of the first antenna.
12. The substrate treating method of claim 11 , wherein a length from an upper end to a lower end of the first antenna is shorter than a length from an upper end to a lower end of the second antenna.
13. The substrate treating method of claim 11 , wherein the ignition of the plasma is initiated while the electric power applied to the first antenna is maximized and the electric power applied to the second antenna is minimized.
14. The substrate treating method of claim 11 , wherein when the ignition of the plasma is initiated and a preset time period elapses, the electric power applied to the first antenna is minimized and the electric power applied to the second antenna is maximized.
15. The substrate treating method of claim 11 , wherein electric power is distributed to the first antenna and the second antenna by utilizing variable capacitors.
16. The substrate treating method of claim 11 , wherein electric power is distributed to the first antenna and the second antenna by utilizing a first variable capacitor connected in series to the first antenna and a second variable capacitor connected in series to the second antenna.
17. A plasma generating unit comprising:
a plasma generating chamber having a space, into which a gas is introduced;
a first antenna wound to surround the plasma generating chamber and connected to a power source through a first electric wire;
a second antenna wound to surround the plasma generating chamber and connected to the power source through a second electric wire to be disposed in parallel to the first antenna; and
power distributing members provided in the first antenna and the second antenna to distribute electric power supplied from the power source to the first antenna and the second antenna,
wherein the first antenna is wound a plurality of times from a first location to a second location, and the second antenna is wound a plurality of times from a third location to a fourth location,
wherein the first location is higher than the second location, and the third location is between the first location and the second location, and
wherein intervals between windings of the first antenna are the same, intervals between windings of the second antenna are the same, and the intervals between the windings of the second antenna are smaller than the intervals of the windings of the first antenna.
18. The plasma generating unit of claim 17 , wherein the power distributing members include:
a first variable capacitor located in the first electric wire; and
a second variable capacitor located in the second electric wire.
19. The plasma generating unit of claim 17 , further comprising:
a controller configured to control the power distributing members such that ignition of plasma is initiated while electric power applied to the first antenna is higher than electric power applied to the second antenna.
20. The plasma generating unit of claim 19 , wherein the controller decreases the electric power applied to the first antenna and increases the electric power applied to the second antenna when a preset time period elapses after the ignition of the plasma is initiated.
21. The plasma generating unit of claim 17 , wherein a length between an upper end and a lower end of the first antenna is shorter than a length between an upper end and a lower end of the second antenna.
22. The plasma generating unit of claim 17 , wherein the power distributing members include:
a first switch located in the first electric wire; and
a second switch located in the second electric wire.
23. The plasma generating unit of claim 22 , further comprising:
a controller configured to perform a control such that the second switch is switched on when a preset time period elapses after ignition of plasma is initiated while the first switch is switched on and the second switch is switched off.