IP Library Granted Patent US 10,305,189
Granted Patent B2
US 10,305,189 · App. 15/685,010 · Granted May 28, 2019

Antenna module

Inventor: Hideki Ueda (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q9/0414H01Q1/2283H01Q1/243H01Q9/0407H01Q9/32H01Q21/06H01Q21/28H01Q21/29H01Q9/0471H01Q21/0093
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Quick Facts
Patent No.
US 10,305,189
App. No.
15/685,010
Granted
May 28, 2019
Kind
B2
Abstract

A circuit element mounting portion provided on a dielectric substrate is configured so as to mount a high-frequency integrated circuit element, and includes a ground land and a plurality of high-frequency signal lands. The dielectric substrate is provided with an antenna element including at least one radiation element. The dielectric substrate is provided with an exposed terminal portion including an exposed ground land and an exposed high-frequency signal land. The dielectric substrate is provided with a first transmission line connecting one high-frequency signal land of the circuit element mounting portion and the radiation element. Furthermore, a second transmission line connecting another high-frequency signal land of the circuit element mounting portion and the high-frequency signal land of the exposed terminal portion, and a ground conductor connecting the ground land of the circuit element mounting portion and the ground land of the exposed terminal portion are provided.

Claims (33)

1. An antenna module comprising:

a dielectric substrate;

a circuit element mounting portion provided on the dielectric substrate, the circuit element mounting portion mounting a high-frequency integrated circuit element and including a ground land and a plurality of high-frequency signal lands;

an antenna element including at least one radiation element provided with the dielectric substrate;

an exposed terminal portion provided on the dielectric substrate, the exposed terminal portion including an exposed ground land and an exposed high-frequency signal land;

a first transmission line provided with the dielectric substrate, the first transmission line connecting one high-frequency signal land of the circuit element mounting portion and the radiation element;

a second transmission line provided with the dielectric substrate, the second transmission line connecting another high-frequency signal land of the circuit element mounting portion and the high-frequency signal land of the exposed terminal portion; and

a ground conductor connecting the ground land of the circuit element mounting portion and the ground land of the exposed terminal portion.

2. The antenna module according to claim 1 ,

wherein the antenna element includes the radiation element provided on a surface on an opposite side from a surface of the dielectric substrate on which the circuit element mounting portion is provided, and

the exposed terminal portion is provided on a surface same as the surface of the dielectric substrate on which the circuit element mounting portion is provided.

3. The antenna module according to claim 2 ,

wherein the circuit element mounting portion further includes an intermediate-frequency signal land and a DC power supply land, and

the exposed terminal portion further includes an exposed intermediate-frequency signal land and an exposed DC power supply land,

the antenna module further comprising:

an intermediate-frequency signal fourth transmission line provided in the dielectric substrate, the intermediate-frequency signal fourth transmission line connecting the intermediate-frequency signal land of the circuit element mounting portion and the intermediate-frequency signal land of the exposed terminal portion; and

a power supply wiring provided in the dielectric substrate, the power supply wiring connecting the DC power supply land of the circuit element mounting portion and the DC power supply land of the exposed terminal portion.

4. The antenna module according to claim 1 ,

wherein the dielectric substrate is configured of a flexible printed circuit substrate,

the antenna element is provided on the surface on an opposite side from the surface of the dielectric substrate on which the circuit element mounting portion is provided, and the antenna element includes the radiation element disposed at a position at least partially overlapping with the circuit element mounting portion, and

the exposed terminal portion is disposed at a position not overlapping with both the circuit element mounting portion and the radiation element.

5. The antenna module according to claim 4 ,

wherein the circuit element mounting portion further includes an intermediate-frequency signal land and a DC power supply land, and

the exposed terminal portion further includes an exposed intermediate-frequency signal land and an exposed DC power supply land,

the antenna module further comprising:

an intermediate-frequency signal fourth transmission line provided in the dielectric substrate, the intermediate-frequency signal fourth transmission line connecting the intermediate-frequency signal land of the circuit element mounting portion and the intermediate-frequency signal land of the exposed terminal portion; and

a power supply wiring provided in the dielectric substrate, the power supply wiring connecting the DC power supply land of the circuit element mounting portion and the DC power supply land of the exposed terminal portion.

6. The antenna module according to claim 1 ,

wherein the circuit element mounting portion further includes an intermediate-frequency signal land and a DC power supply land, and

the exposed terminal portion further includes an exposed intermediate-frequency signal land and an exposed DC power supply land,

the antenna module further comprising:

an intermediate-frequency signal fourth transmission line provided in the dielectric substrate, the intermediate-frequency signal fourth transmission line connecting the intermediate-frequency signal land of the circuit element mounting portion and the intermediate-frequency signal land of the exposed terminal portion; and

a power supply wiring provided in the dielectric substrate, the power supply wiring connecting the DC power supply land of the circuit element mounting portion and the DC power supply land of the exposed terminal portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: UEDA, HIDEKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 043384/0122 →
Priority Claims (1)
JP 2016-165647 · Aug 26, 2016 · national
Continuity (1)
Related Publication 20180062263A1 · Mar 1, 2018