Cell pillar structures and integrated flows
View Patent ↗Various embodiments comprise apparatuses and methods, such as a memory stack having a continuous cell pillar. In various embodiments, the apparatus includes a source material, a buffer material, a select gate drain (SGD), and a memory stack arranged between the source material and the SGD. The memory stack comprises alternating levels of conductor materials and dielectric materials. A continuous channel-fill material forms a cell pillar that is continuous from the source material to at least a level corresponding to the SGD.
1. An apparatus, comprising:
a source material including a transition metal combined with a semiconductor material;
an active switching device;
a memory stack arranged between the source material and the active switching device and having alternating levels of conductive materials and dielectric materials such that each level of conductive material is separated from another level of conductive material by a level of dielectric material, at least some of the conductive materials including a recessed charge storage structure formed substantially within a level of respective ones of the conductive material and separated from adjacent portions of the dielectric material by a charge-blocking dielectric material;
a buffer material formed between a level corresponding to the source material and the memory stack; and
a channel-fill material that is continuous from the source material to a level of the active switching device, the charge storage structures formed laterally away from the channel-fill material.
2. The apparatus of claim 1 , wherein each of the recessed charge storage structures are formed substantially between adjacent ones of the alternating levels of dielectric materials.
3. The apparatus of claim 1 , wherein at least one of the dielectric materials is a solid electrolyte.
4. The apparatus of claim 1 , wherein at least one of the dielectric materials is a chalcogenide.
5. The apparatus of claim 1 , wherein the channel-fill material forms a cell pillar.
6. The apparatus of claim 1 , wherein the source material comprises tungsten disilicide.
7. The apparatus of claim 1 , wherein the source material comprises tungsten silicide.
8. The apparatus of claim 1 , further comprising a buffer material formed between the level corresponding to the source material and the memory stack.
9. The apparatus of claim 1 , wherein the conductive material comprises a semiconductor material.
10. The apparatus of claim 9 , wherein the semiconductor material comprises a conductively-doped polysilicon.
11. An apparatus, comprising:
a source material including a transition metal combined with a semiconductor material;
a channel-fill material; and
a memory stack having alternating levels of conductive materials and dielectric materials such that each level of conductive material is separated from another level of conductive material by a level of dielectric material, the memory stack including multiple recessed charge storage structures formed substantially within a level of respective ones of the conductor material and laterally away from the channel-fill material and substantially between adjacent ones of the alternating levels of dielectric materials.
12. The apparatus of claim 11 , wherein the multiple recessed charge storage structures are separated from a remaining portion of the conductive material on the same level by a dielectric material.
13. The apparatus of claim 11 , wherein the dielectric material is an inter-polysilicon dielectric material and the charge storage structure includes a charge storage material formed over the inter-polysilicon dielectric material.
14. The apparatus of claim 13 , wherein the inter-polysilicon dielectric material is a charge-blocking dielectric material.
15. The apparatus of claim 13 , wherein the inter-polysilicon dielectric material is a high-dielectric constant material.
16. The apparatus of claim 11 , wherein a tunneling material is formed over the charge storage material.
17. The apparatus of claim 11 , further comprising
a buffer material formed between a level corresponding to the source material and the memory stack; and
a switching device, wherein the memory stack is between the source material and the switching device.
18. An apparatus, comprising:
a source material including a transition metal combined with a semiconductor material;
a memory stack having alternating levels of semiconductor materials and dielectric materials, each level of the semiconductor materials being separated from an adjacent level of the semiconductor materials by one of the levels of dielectric materials; and
multiple recessed charge storage structures formed substantially between adjacent ones of the alternating levels of dielectric materials and substantially within a level of respective ones of the semiconductor material, the multiple recessed charge storage structures formed laterally away from a channel-fill material, each of the multiple recessed charge storage structures being separated from adjacent portions of the dielectric material by an inter-polysilicon dielectric material.
19. The apparatus of claim 18 , wherein the source material comprises tungsten silicide; and further comprising
a switching device, wherein the channel-fill material is continuous from the source material to a level of the switching device.
20. The apparatus of claim 18 , wherein the memory stack includes conductive-bridging random-access memory cells.