IP Library Granted Patent US 10,354,732
Granted Patent B2
US 10,354,732 · App. 15/690,920 · Granted Jul 16, 2019

NAND temperature data management

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Quick Facts
Patent No.
US 10,354,732
App. No.
15/690,920
Granted
Jul 16, 2019
Kind
B2
Abstract

Devices and techniques for NAND temperature data management are disclosed herein. A command to write data to a NAND component in the NAND device is received at a NAND controller of the NAND device. A temperature corresponding to the NAND component is obtained in response to receiving the command. The command is then executed to write data to the NAND component and to write a representation of the temperature. The data is written to a user portion and the representation of the temperature is written to a management portion that is accessible only to the controller and segregated from the user portion.

Claims (41)

1. A NAND device for NAND temperature data management, the NAND device comprising:

a NAND component; and

a NAND controller to perform operations comprising:

receiving a command to write data to the NAND component;

obtaining a temperature corresponding to the NAND component in response to receiving the command; and

executing the command to write data to the NAND component and to write a representation of the temperature, the data written to a user portion and the representation of the temperature written to a management portion that is accessible only to the NAND controller and segregated from the user portion, wherein the representation of the temperature is a quantization of the temperature at a lower resolution than the obtained temperature.

2. The NAND device of claim 1 , wherein the management portion is on the NAND component.

3. The NAND device of claim 2 , wherein the NAND component is a page.

4. The NAND device of claim 3 , wherein the management portion is auxiliary bytes of the page.

5. The NAND device of claim 1 , wherein, to obtain the temperature, the NAND controller obtains the temperature from a thermometer in response to receiving the command.

6. The NAND device of claim 1 , wherein the NAND controller is further read the data from the NAND component and reading the representation of the temperature.

7. The NAND device of claim 6 , wherein, the NAND controller reads the data in response to receiving a read command, and wherein the representation of the temperature is used to correct a read voltage for the data to reduce read errors.

8. The NAND device of claim 7 , wherein the representation of the temperature is provided to a host invoking the read command, and wherein the host uses the representation of the temperature correct the read voltage.

9. The NAND device of claim 6 , wherein the NAND controller reads the data in response to a power-on condition of the NAND device, and wherein the representation of the temperature is cached in a volatile memory for future read operations.

10. The NAND device of claim 1 , wherein the quantization is selected from a set of temperature ranges, and wherein the representation of the temperature is an identifier of a member of the set of temperature ranges.

11. A method for NAND temperature data management, the method comprising:

receiving, at a controller of a NAND device, a command to write data to a NAND component in the NAND device;

obtaining a temperature corresponding to the NAND component in response to receiving the command; and

executing the command to write data to the NAND component and to write a representation of the temperature, the data written to a user portion and the representation of the temperature written to a management portion that is accessible only to the controller and segregated from the user portion, wherein the representation of the temperature is a quantization of the temperature at a lower resolution than the obtained temperature.

12. The method of claim 11 , wherein the management portion is on NAND component.

13. The method of claim 12 , wherein the NAND component is a page.

14. The method of claim 13 , wherein the management portion is auxiliary bytes of the page.

15. The method of claim 11 , wherein obtaining he temperature includes obtaining the temperature from a thermometer in response to receiving the command.

16. The method of claim 11 , comprising reading the data from the NAND component and reading the representation of the temperature.

17. The method if claim 16 , wherein reading the data is in response to receiving a read command at the controller, and wherein the representation of the temperature is used to correct a read voltage for the data to reduce read errors.

18. The method of claim 17 , wherein the representation of the temperature is provided to a host invoicing the read command, and wherein the host uses the representation of the temperature to correct the read voltage.

19. The method of claim 16 , wherein reading the data is in response to a power-on condition of the NAND device, and wherein the representation of the temperature is cached in a volatile memory for future read operations.

20. The method of claim 11 , wherein the quantization is selected from a set of temperature ranges, and wherein the representation of the temperature is an identifier of a member of the set of temperature ranges.

21. At least one machine readable medium including instructions that, when executed by processing circuitry, cause the processing circuitry to perform operations comprising:

receiving, at a controller of a NAND device, a command to write data to a NAND component in the NAND device;

obtaining a temperature corresponding to the NAND component in response to receiving the command; and

executing the command to write data to the NAND component and to write a representation of the temperature, the data written to a user portion and the representation of the temperature written to a management portion that is accessible only to the controller and segregated from the user portion, wherein the representation of the temperature is a quantization of the temperature at a lower resolution than the obtained temperature.

22. The machine readable medium of claim wherein the management portion is on the NAND component.

23. The machine readable medium of claim 22 , wherein the NAND component is a page.

24. The machine readable medium of claim 23 , wherein the management portion is auxiliary bytes of the page.

25. The machine readable medium of claim 21 , wherein obtaining the temperature includes obtaining the temperature from a thermometer in response to receiving the command.

26. The machine readable medium of claim 21 , wherein the operations comprise reading the data from the NAND component and reading the representation of the temperature.

27. The machine readable medium of claim 26 , wherein reading the data is in response to receiving a read command at the controller, and wherein the representation of the temperature is used to correct a read voltage for the data to reduce read errors.

28. The machine readable medium of claim 27 , wherein the representation of the temperature is provided to a host invoking the read command, and wherein the host uses the representation of the temperature to correct the read voltage.

29. The machine readable medium of claim 26 , wherein reading the data is in response to a power-on condition of the NAND device, and wherein the representation of the temperature is cached in a volatile memory for future read operations.

30. The machine readable medium of claim 21 , wherein the quantization is selected from a set of temperature ranges, and wherein the representation of the temperature is an identifier of a member of the set of temperature ranges.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2018
From: MUCHHERLA, KISHORE KUMAR; RATNAM, SAMPATH; THOMSON, PRESTON; SINGIDI, HARISH REDDY; HOEI, JUNG SHENG; FEELEY, PETER SEAN; HUANG, JIANMIN
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047641/0968 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →