Graphene-copper structure and manufacturing method
A multilayer structure comprises a plurality of composite structures in a stacked configuration, each having a copper layer having a thickness of no larger than 25 μm, and first and second graphene layers sandwiching the copper layer. The first graphene layer of a first composite structure among the plurality of composite structures directly contacts a second graphene layer of a second composite structure among the plurality of composite structures to form a graphene bi-layer structure. Either the first or second graphene layer of the graphene bi-layer structure comprises silver atoms, but not both. The silver atoms are ring-centered on graphene rings and delocalized inside the graphene rings.
1. A multilayer structure comprising:
a plurality of composite structures in a stacked configuration;
wherein each of the plurality of composite structures comprises:
a copper layer having a thickness of no larger than 25 μm; and
first and second graphene layers sandwiching the copper layer;
wherein, a first graphene layer of a first composite structure among the plurality of composite structures directly contacts a second graphene layer of a second composite structure among the plurality of composite structures to form a graphene bi-layer structure; and
wherein either the first graphene layer or the second graphene layer of the graphene bi-layer structure comprises silver (Ag) atoms but not both, and wherein the Ag atoms are ring-centered on graphene rings and delocalized inside the graphene rings.
2. The multilayer structure according to claim 1 , wherein at least one of the first graphene layer and the second graphene layer has a thickness that is less or equal to 5 nm.
3. The multilayer structure according to claim 1 , wherein at least one of the first graphene layer and the second graphene layer has a thickness that is less or equal to 2 nm.
4. The multilayer structure according to claim 1 , wherein the copper layer has a thickness of 10 μm or less.
5. The multilayer structure according to claim 1 , wherein the copper layer has a thickness of 5 μm or less.
6. The multilayer structure according to claim 1 , wherein at least part of the copper layer has a (111) crystallographic orientation.
7. The multilayer structure according to claim 1 , wherein the copper layer has a grain size of at least 1 μm.
8. The multilayer structure according to claim 1 , wherein the copper layer has a grain size of at least 5 μm.