IP Library Granted Patent US 10,282,134
Granted Patent B2
US 10,282,134 · App. 15/693,128 · Granted May 7, 2019

Methods of synchronizing memory operations and memory systems employing the same

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Quick Facts
Patent No.
US 10,282,134
App. No.
15/693,128
Granted
May 7, 2019
Kind
B2
Abstract

A memory system is provided. The memory system includes a first memory device having a first latency corresponding to a first command and a second memory device having a second latency corresponding to a second command. The second latency differs from the first latency by a latency difference. The memory system further includes a host operably coupled to the first and second memory devices. The host is configured to send the first command to the first memory device at a first time, and to send the second command to the second memory device at a second time. The first time and the second time are separated by a delay corresponding to the latency difference.

Claims (44)

1. A memory system, comprising:

a first memory device having a first latency corresponding to a first command;

a second memory device having a second latency corresponding to a second command, wherein the second latency differs from the first latency by a latency difference; and

a host operably coupled to the first and second memory devices, and configured to:

send the first command to the first memory device at a first time, and

send the second command to the second memory device at a second time,

wherein the first time and the second time are separated by a delay corresponding to the latency difference,

wherein the first command is a termination command configured to place the first memory device into a termination mode, and the second command is a data transfer command place the second memory device into a data transfer mode.

2. The memory system of claim 1 , wherein:

in response to the first command, the first memory device performs a first operation at a third time, and

in response to the second command, the second memory device performs a second operation at the third time.

3. The memory system of claim 2 , wherein the third time differs from the first time by the first latency, and from the second time by the second latency.

4. The memory system of claim 1 , wherein the host is further configured to:

poll the first and second memory devices to determine the first and second latencies.

5. The memory system of claim 1 , wherein the first and second memory devices each comprise one of a DIMM module and an NVDIMM module.

6. The memory system of claim 1 , wherein the first and second memory devices are operably coupled to a shared memory bus.

7. A memory system, comprising:

a first memory device having a first latency corresponding to a termination command;

a second memory device having a second latency corresponding to a data transfer command, wherein the second latency differs from the first latency by a latency difference; and

a host operably coupled to the first and second memory devices, and configured to:

send the termination command to the first memory device at a first time, and

send the data transfer command to the second memory device at a second time,

wherein the first time and the second time are separated by a delay corresponding to the latency difference.

8. The memory system of claim 7 , wherein:

in response to the termination command, the first memory device enters a termination mode at a third time, and

in response to the data transfer command, the second memory device performs a data transfer operation at the third time.

9. The memory system of claim 8 , wherein the third time differs from the first time by the first latency, and from the second time by the second latency.

10. The memory system of claim 7 , wherein the host is further configured to:

poll the first and second memory devices to determine the first and second latencies.

11. The memory system of claim 7 , wherein the data transfer command is one of a read command, a write command, or a status command.

12. The memory system of claim 7 , wherein the first and second memory devices each comprise one of a DIMM module and an NVDIMM module.

13. The memory system of claim 7 , wherein the first and second memory devices are operably coupled to a shared memory bus.

14. A method of operating a memory system including a first memory device having a first latency corresponding to a first command and a second memory device having a second latency corresponding to a second command, wherein the first latency differs from the second latency by a latency difference, the method comprising:

sending a first command to the first memory device at a first time;

sending a second command to the second memory device at a second time, wherein the first time and the second time are separated by a delay corresponding to the latency difference,

wherein the first command is a termination command configured to place the first memory device into a termination mode, and the second command is a data transfer command place the second memory device into a data transfer mode.

15. The method of claim 14 , further comprising:

the first memory device performing a first operation corresponding to the first command at a third time; and

the second memory device performing a second operation corresponding to the second command at the third time.

16. The method of claim 15 , wherein the third time differs from the first time by the first latency, and from the second time by the second latency.

17. The method of claim 14 , further comprising:

polling the first and second memory devices to determine the first and second latencies.

18. The method of claim 14 , wherein the first and second memory devices each comprise one of a DIMM module and an NVDIMM module.

19. The method of claim 14 , wherein the first and second memory devices are operably coupled to a shared memory bus.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2017
From: PRATHER, MATTHEW A.; ROSS, FRANK F.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 043603/0333 →