Systems and methods for a MEMS actuation systems device with one or more slidable connection assemblies
A micro-electrical-mechanical system (MEMS) device includes one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made. The MEMS device may include a MEMS actuation core, and a MEMS electrical connector assembly electrically coupled to the MEMS actuation core configured to be electrically coupled to a printed circuit board.
1. A micro-electrical-mechanical system (MEMS) device comprising:
one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made, wherein the one or more slidable connection assemblies includes one or more finger assemblies on the micro-electrical-mechanical system (MEMS) device and one or more socket assemblies on the wafer that are configured to receive the one or more finger assemblies.
2. The micro-electrical-mechanical system (MEMS) device of claim 1 wherein the one or more slidable connection assemblies includes a portion of the wafer.
3. The micro-electrical-mechanical system (MEMS) device of claim 2 wherein the portion of the wafer provides support on the wafer.
4. The micro-electrical-mechanical system (MEMS) device of claim 1 wherein the micro-electrical-mechanical system (MEMS) device includes:
a MEMS actuation core; and
a MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board.
5. The micro-electrical-mechanical system (MEMS) device of claim 4 wherein the one or more slidable connection assemblies includes a portion of the MEMS actuation core.
6. The micro-electrical-mechanical system (MEMS) device of claim 4 wherein the one or more slidable connection assemblies includes a portion of the MEMS electrical connector assembly.
7. The micro-electrical-mechanical system (MEMS) device of claim 1 wherein the one or more socket assemblies on the wafer includes:
a spanning structure configured to span at least two fingers of the wafer, thus forming the one or more socket assemblies therebetween.
8. The micro-electrical-mechanical system (MEMS) device of claim 1 wherein the one or more slidable connection assemblies includes:
one or more finger assemblies on the wafer.
9. The micro-electrical-mechanical system (MEMS) device of claim 8 wherein the one or more slidable connection assemblies includes:
one or more socket assemblies on the micro-electrical-mechanical system (MEMS) device that are configured to receive the one or more finger assemblies.
10. The micro-electrical-mechanical system (MEMS) device of claim 9 wherein the one or more socket assemblies on the micro-electrical-mechanical system (MEMS) device includes:
a spanning structure configured to span at least two fingers of the micro-electrical-mechanical system (MEMS) device, thus forming the one or more socket assemblies therebetween.
11. A micro-electrical-mechanical system (MEMS) device comprising:
a MEMS actuation core;
a MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board; and
one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made, wherein the one or more slidable connection assemblies includes one or more finger assemblies on the micro-electrical-mechanical system (MEMS) device and one or more socket assemblies on the wafer that are configured to receive the one or more finger assemblies.
12. The micro-electrical-mechanical system (MEMS) device of claim 11 wherein the one or more slidable connection assemblies includes a portion of the wafer.
13. The micro-electrical-mechanical system (MEMS) device of claim 12 wherein the portion of the wafer provides support on the wafer.
14. The micro-electrical-mechanical system (MEMS) device of claim 11 wherein the one or more slidable connection assemblies includes a portion of the MEMS actuation core.
15. The micro-electrical-mechanical system (MEMS) device of claim 11 wherein the one or more slidable connection assemblies includes a portion of the MEMS electrical connector assembly.
16. A micro-electrical-mechanical system (MEMS) device comprising:
a MEMS actuation core;
a MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board; and
one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made, wherein the one or more slidable connection assemblies includes one or more finger assemblies on the micro-electrical-mechanical system (MEMS) device and one or more socket assemblies on the wafer that are configured to receive the one or more finger assemblies.
17. The micro-electrical-mechanical system (MEMS) device of claim 16 wherein the one or more slidable connection assemblies includes:
a spanning structure configured to span at least two fingers of the wafer, thus forming the one or more socket assemblies therebetween.
18. The micro-electrical-mechanical system (MEMS) device of claim 16 wherein the one or more slidable connection assemblies includes:
one or more finger assemblies on the wafer; and
one or more socket assemblies on the micro-electrical-mechanical system (MEMS) device that are configured to receive the one or more finger assemblies, including:
a spanning structure configured to span at least two fingers of the micro-electrical-mechanical system (MEMS) device, thus forming the one or more socket assemblies therebetween.