IP Library Granted Patent US 10,297,294
Granted Patent B2
US 10,297,294 · App. 15/703,365 · Granted May 21, 2019

Apparatuses and methods for performing intra-module databus inversion operations

Inventors: Timothy M. Hollis (Meridian, ID); Huy T. Vo (Boise, ID); Dirgha Khatri (Boise, ID)
Assignee: Micron Technology, Inc.
G11C7/10G11C5/04G11C7/1006G11C7/22
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Quick Facts
Patent No.
US 10,297,294
App. No.
15/703,365
Granted
May 21, 2019
Kind
B2
Abstract

Apparatuses, memory modules, and methods for performing intra-module data bus inversion operations are described. An example apparatus include a memory module comprising a data bus inversion (DBI) and buffer circuit and a plurality of memories. The DBI and buffer circuit configured to encode a block of data received by the memory module and to provide DBI data and a corresponding DBI bit to a respective memory of the plurality of memories.

Claims (36)

1. An apparatus, comprising:

a memory comprising a memory array and a first data bus inversion (DBI) logic circuit, the first DBI logic circuit configured to perform a DBI encoding operation and a DBI decoding operation; and

a second DBI logic circuit coupled to the memory, the second DBI logic circuit configured to perform a DBI encoding operation and a DBI decoding operation.

2. The apparatus of claim 1 , further comprising a data buffer configured to communicate a data with a host via an external terminal of the apparatus.

3. The apparatus of claim 2 , wherein the second DBI logic circuit is further coupled to the external terminal without the data buffer coupled in between.

4. The apparatus of claim 1 , further comprising a data buffer coupled between the second DBI logic circuit and the memory.

5. The apparatus of claim 4 , wherein the second DBI logic circuit is further coupled to the memory without the data buffer coupled in between.

6. The apparatus of claim 1 , further comprising a DBI buffer coupled between the second DBI logic circuit and the memory.

7. The apparatus of claim 1 , wherein the first DBI logic circuit is coupled between the second DBI logic circuit and the memory array.

8. The apparatus of claim 1 , wherein the apparatus is a memory module.

9. The apparatus of claim 8 , the memory module is a load reduced dual in-line memory module.

10. An apparatus, comprising:

a data bus;

a data bus inversion (DBI) bus;

a memory coupled to a first end of the data bus and a first end of the DBI bus, the memory comprising a memory array and a first data bus inversion (DBI) logic circuit, the first DBI logic circuit configured to perform a DBI encoding operation and a DBI decoding operation; and

a second DBI logic circuit coupled to the second end of the data bus and a second end of the DBI bus, the second DBI logic circuit configured to perform a DBI encoding operation and a DBI decoding operation.

11. The apparatus of claim 10 , further comprising;

an external terminal;

a data buffer coupled between the external terminal and the second DBI logic circuit.

12. The apparatus of claim 11 , wherein the second DBI logic circuit is further coupled to the external terminal without the data buffer coupled in between.

13. The apparatus of claim 10 , further comprising a data buffer coupled between the second DBI logic circuit and the data bus.

14. The apparatus of claim 10 , further comprising a DBI buffer coupled between the second DBI logic circuit and the DBI bus.

15. The apparatus of claim 10 , wherein the first DBI logic circuit is coupled between the second DBI logic circuit and the memory array.

16. The apparatus of claim 10 , wherein the apparatus is a memory module.

17. The apparatus of claim 16 , the memory module is a load reduced dual in-line memory module.

18. A method, comprising:

receiving a first data from a host;

encoding the first data by a first data bus inversion (DBI) logic circuit to produce a first encoded data and a first DBI bit;

receiving the first encoded data and the first DBI bit by a memory;

decoding the first encoded data based on the first DBI bit by a second DBI logic circuit in the memory;

encoding a second data stored in the memory array by the second DBI logic circuit to produce a second encoded data and a second DBI bit;

receiving the second encoded data and the second DBI bit by the first DBI logic circuit; and

decoding the second encoded data based on the second DBI bit by the first DBI logic circuit to produce a decoded second encoded data.

19. The method of claim 18 , further comprising:

after encoding the first data by the first DBI logic circuit to produce the first encoded data and the first DBI bit, storing the first encoded data and the first DBI data into a data buffer and a DBI buffer respectively.

20. The method of claim 19 , wherein the receiving the first data from the host comprises receiving the first data at an external terminal of a memory module.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2017
From: HOLLIS, TIMOTHY M.; VO, HUY T.; KHATRI, DIRGHA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 043577/0106 →
Continuity (2)
Continuation 15159728 · May 19, 2016
Related Publication 20180005671A1 · Jan 4, 2018
Cited By (1)
US 12,646,558