High resolution, non-contact removal rate module for serial sectioning
View Patent ↗The present invention relates to a metallographic system including a measurement module configured to provide precise differential measurements of a sample after serial sectioning, as well as methods of employing such a module. In particular example, the measurement module provides differential measurement(s) without contacting the surface of a sample, thereby minimizing contamination of the sample surface.
1. A metallographic system comprising:
a robotic arm configured to manipulate a sample and to present a first top surface of the sample, wherein the arm further comprises a reference structure configured to provide a reference surface that is generally parallel to the first top surface of the sample, and wherein the reference structure and the sample are disposed on a distal portion of the arm;
a sensor configured to measure a reference distance between the sensor and a portion of the reference surface and to measure a sample distance between the sensor and a portion of the first top surface of the sample;
an analyzer configured to examine the first top surface of the sample; and
a polisher configured to polish the first top surface of the sample to provide a second top surface,
wherein the robotic arm is configured to move the sample between the sensor, the analyzer, and the polisher.
2. The system of claim 1 , wherein the reference structure comprises a machined ring disposed on a distal portion of the arm, and wherein the ring is in proximity to the sample that is also disposed on a distal portion of the arm.
3. The system of claim 1 , wherein the reference distance is unchanging.
4. The system of claim 1 , wherein the sensor is further configured to measure a further sample distance between the sensor and a portion of the second top surface provided by the polisher.
5. The system of claim 1 , wherein the sensor comprises:
a mount; and
a laser interferometer disposed upon the mount, wherein a laser beam emitted by the interferometer is configured to provide the reference distance and the sample distance.
6. The system of claim 5 , wherein the mount comprises a three-axis mount.
7. The system of claim 6 , wherein the laser interferometer comprises a red semiconductor laser configured to emit the laser beam.
8. The system of claim 1 , wherein the analyzer comprises an optical microscope, an electron microscope, an optical camera, a CCD camera, an X-ray camera, and/or a spectroscope.
9. The system of claim 1 , wherein the polisher comprises one or more platens configured to polish a surface of the sample, thereby providing a surface for examination by the analyzer.
10. The system of claim 9 , further comprising:
a loader configured to contain one or more samples;
and/or
a mounting clip configured to mount one or more samples.
11. The system of claim 10 , further comprising:
a processing unit configured to control the robotic arm, the sensor, the analyzer, the polisher, the loader, and/or the mounting clip.
12. The system of claim 11 , wherein the processing unit is configured to provide a predetermined degree of polishing by the polisher and configured to measure the reference distance and the sample distance by the sensor.
13. The system of claim 12 , wherein the processing unit is further configured to perform image analysis and to position the sample for examination by the analyzer based on feedback from the sensor.
14. The system of claim 11 , wherein the processing unit is configured to control the robotic arm to manipulate the sample between the sensor and the analyzer.
15. The system of claim 11 , wherein the processing unit is configured to control the robotic arm to manipulate the sample between the polisher and the sensor.
16. The system of claim 11 , wherein the processing unit is configured to control the robotic arm to manipulate the sample between the analyzer and the polisher.
17. A method comprising:
providing a robotic arm configured to manipulate a sample and to present a first top surface of the sample, wherein the arm further comprises a reference structure configured to provide a reference surface that is generally parallel to the first top surface of the sample, and wherein the reference structure and the sample are disposed on a distal portion of the arm;
manipulating the sample to a sensor, wherein the sensor is configured to measure a first reference distance between the sensor and a portion of the reference surface and to measure a first sample distance between the sensor and a portion of a first top surface of the sample;
obtaining the first reference distance and the first sample distance;
manipulating the sample to an analyzer configured to examine the first top surface of the sample; and
examining the first top surface of the sample.
18. The method of claim 17 , further comprising, prior to manipulating a sample to a sensor:
manipulating the sample to a polisher configured to polish a surface of the sample to provide the first top surface; and
polishing the sample to provide the first top surface.
19. The method of claim 17 , further comprising, after examining the first surface:
manipulating the sample to a polisher configured to polish the first top surface of the sample to provide a second top surface; and
polishing the sample to provide the second top surface.
20. The method of claim 19 , further comprising, after polishing the sample:
manipulating the sample to the sensor, wherein the sensor is configured to measure a second reference distance between the sensor and a portion of the reference surface and to measure a second sample distance between the sensor and a portion of the second top surface of the sample;
obtaining the second reference distance and the second sample distance;
manipulating the sample to the analyzer configured to examine the second top surface of the sample; and
examining the second top surface of the sample.
21. The method of claim 17 , wherein the reference structure comprises a machined ring disposed on a distal portion of the robotic arm, and wherein the ring is in proximity to the sample that is also disposed on a distal portion of the arm.
22. The method of claim 17 , wherein the obtaining step comprises determining the difference between the first reference distance and the first sample distance, thereby establishing a first slice thickness.
23. The method of claim 17 , further comprising:
obtaining the sample from a loader configured to contain one or more samples;
washing, rinsing, treating, and/or drying one or more samples; and/or
affixing one or more samples onto a handling mount.