Memory device

1. A memory device comprising:

a first memory cell array including a plurality of first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the plurality of first electrode layers in the first direction;

a first contact plug extending in the first direction through the first memory cell array, and electrically connected to the first semiconductor pillar;

a second memory cell array disposed above the first memory cell array, the second memory cell array including a plurality of second electrode layers stacked in the first direction, a second semiconductor pillar extending in the first direction through the plurality of second electrode layers, and an interconnection electrically connected to the second semiconductor pillar, the interconnection being disposed between the first electrode layers and the second electrode layers; and

a second contact plug extending in the first direction through the second memory cell array, and electrically connected to the interconnection and the first contact plug.

2. The device according to claim 1 , further comprising:

a circuit driving the first memory cell array and the second memory cell array,

wherein the first memory cell array is provided between the second memory cell array and the circuit.

3. The device according to claim 2 , further comprising:

a first interconnection electrically connected to the second contact plug; and

a connecting conductor provided in a periphery around the first memory cell array and the second memory cell array, and electrically connecting the circuit and the first interconnection.

4. The device according to claim 3 , wherein

the connecting conductor includes a first conductive part provided in a periphery around the first memory cell array, a second conductive part provided in a periphery around the second memory cell array, and a joint part provided between the first conductive part and the second conductive part, and

the joint part includes a first end portion approximate to the first conductive part, a second end portion approximate to the second conductive part, and an intermediate portion between the first end portion and the second end portion, the intermediate portion having a width in a second direction perpendicular to the first direction wider than a width in the second direction of the first end portion and a width in the second direction of the second end portion.

5. The device according to claim 1 , further comprising:

a third contact plug extending in the first direction through the first memory cell array,

the first memory cell array further including a interconnecting layer electrically connected to one end of the first semiconductor pillar, and

the third contact plug being electrically connected to the interconnecting layer.

6. The device according to claim 5 , wherein

The interconnecting layer has a structure including a metal layer and a semiconductor layer stacked, and

the first semiconductor pillar is connected to the semiconductor layer.

7. The device according to claim 5 , wherein

the first contact plug extends through the interconnecting layer, and

the first contact plug is electrically insulated from the interconnecting layer.

8. The device according to claim 1 , further comprising:

a connection pad provided between the first memory cell array and the second memory cell array, and electrically connecting the first contact plug and the second contact plug.

9. The device according to claim 8 , wherein

the connection pad is positioned between the first semiconductor pillar and the second semiconductor pillar.

10. The device according to claim 8 , wherein

the connection pad is positioned between the first contact plug and the second contact plug.

11. The device according to claim 8 , wherein

a bonding interface is provided between the first memory cell array and the second memory cell array, the bonding interface including the connection pad,

the first memory cell array further includes a metal pattern disposed in a periphery around the bonding interface, and

an area ratio of the metal pattern to the periphery of the first memory cell array is larger than an area ratio of the connection pad to the bonding interface.

12. The device according to claim 1 , wherein

the first contact plug extends though the plurality of first electrode layers in the first direction.

13. The device according to claim 1 , wherein

the first memory cell array further includes a plurality of other first electrode layers stacked in the first direction,

the plurality of first electrode layers and the plurality of other first electrode layers are arranged in a third direction crossing the first direction, and

the first contact plug is provided between the plurality of first electrode layers and the plurality of other first electrode layers.

14. A memory device comprising:

a plurality of memory cell arrays stacked in a first direction, the plurality of memory cell arrays each including:

a semiconductor pillar extending in the first direction,

a plurality of first electrode layers stacked in the first direction, and extending in a second direction crossing the first direction,

a plurality of second electrode layers stacked in the first direction, and extending in the second direction, one of the second electrode layers being adjacent to one of the first electrode layers in a third direction crossing the first direction and the second direction, the semiconductor pillar extending between the one of the first electrode layers and the one of the second electrode layers, and,

a first contact plug extending in the first direction between the one of the first electrode layers and the one of the second electrode layers,

the semiconductor pillar being electrically connected to the first contact plug in at least one of the memory cell arrays, and

the first contact plugs of the memory cell arrays being aligned along the first direction and electrically connected in series.

15. The device according to claim 14 , wherein

the memory cell arrays each includes an interconnecting layer electrically connected to the semiconductor pillar, and a second contact plug extending in the first direction between the one of first electrode layers and the one of second electrode layers, the second contact plug being connected to the interconnecting layer,

the first contact plug extending through the interconnecting layer, and being electrically insulated from the interconnecting layer, and

the second contact plugs of the memory cell arrays being aligned along the first direction and electrically connected in series.

16. The device according to claim 14 , further comprising:

a circuit driving the memory cell arrays,

wherein one of the memory cell arrays is disposed between other one of the memory cell arrays and the circuit.

17. The device according to claim 16 , further comprising:

an interconnection electrically connected to the first contact plug; and

a third contact plug provided in a periphery around the memory cell arrays, and electrically connecting the interconnection and the circuit,

wherein the memory cell arrays are positioned between the circuit and the interconnection.

18. The device according to claim 14 , wherein

the respective memory cell arrays further include connection pads electrically connected to the first contact plugs respectively, and

the first contact plugs are connected in series via the connection pads.

19. The device according to claim 18 , wherein

the connection pads are disposed between the first contact plugs respectively.

20. The device according to claim 14 , wherein

the memory cell arrays each include floating gates provided between the semiconductor pillar and the plurality of first electrode layers, and between the semiconductor pillar and the plurality of second electrode layers.