Substrate routing and throughput modeling
Embodiments disclosed herein generally relate to methods, systems, and non-transitory computer readable medium for scheduling a substrate processing sequence in an integrated substrate processing system. A client device assigns a processing sequence to each substrate in a batch of substrates to be processed. The client device assigns a processing chamber to each process in the process sequence for each processing chamber in the integrate substrate processing system. The client device generates a processing model for the batch of substrates. The processing model defines a start time for each substrate in each processing chamber. The client device generates a timetable for the batch of semiconductor substrates based off the processing model. The client device processes the batch of substrates in accordance with the timetable.
1. A method of scheduling a semiconductor substrate processing sequence in an integrated substrate processing system, comprising:
assigning a processing sequence to each semiconductor substrate in a batch of semiconductor substrates to be processed;
for each processing chamber in the integrated substrate processing system, assigning a processing chamber to each process in the processing sequence;
generating a processing model for the batch of semiconductor substrates, wherein the processing model defines a start time for each substrate in each processing chamber;
generating a timetable for the batch of semiconductor substrates based off the processing model; and
processing the batch of semiconductor substrates in accordance with the timetable.
2. The method of claim 1 , wherein the processing sequence is the same for each semiconductor substrate in the batch.
3. The method of claim 1 , wherein the processing sequence is not the same for each semiconductor substrate in the batch.
4. The method of claim 3 , wherein assigning the processing sequence to each semiconductor substrate in the batch of semiconductor substrates to be processed, comprises:
selecting a first semiconductor substrate and a second semiconductor substrate to add to a list of semiconductor substrates to be processed; and
assigning a first processing sequence to the first semiconductor substrate and a second processing sequence to the second semiconductor substrate.
5. The method of claim 4 , wherein generating the processing model for the batch of semiconductor substrates, comprises:
generating a processing model for the first semiconductor substrate and the second semiconductor substrate.
6. The method of claim 5 , further comprising:
identifying an additional semiconductor substrate in the batch to be processed;
upon identifying the additional semiconductor substrate, adding the additional semiconductor substrate to the list of substrates to be processed; and
generating a processing model for the list of semiconductor substrates to be processed.
7. The method of claim 1 , wherein generating a processing model for the batch of semiconductor substrates, comprises:
defining a sequence constraint for each processing chamber in the integrated substrate processing system.
8. A system, comprising:
a processor; and
a memory having instructions stored thereon, which, when executed by the processor, performs an operation for scheduling a semiconductor substrate processing sequence in an integrated substrate processing system, the operation comprising:
assigning a processing sequence to each semiconductor substrate in a batch of semiconductor substrates to be processed;
for each processing chamber in the integrated substrate processing system, assigning a processing chamber to each process in the processing sequence;
generating a processing model for the batch of semiconductor substrates, wherein the processing model defines a start time for each substrate in each processing chamber;
generating a timetable for the batch of semiconductor substrates based off the processing model; and
processing the batch of semiconductor substrates in accordance with the timetable.
9. The system of claim 8 , wherein the processing sequence is the same for each semiconductor substrate in the batch.
10. The system of claim 8 , wherein the processing sequence is not the same for each semiconductor substrate in the batch.
11. The system of claim 10 , wherein assigning the processing sequence to each semiconductor substrate in the batch of semiconductor substrates to be processed, comprises:
selecting a first semiconductor substrate and a second semiconductor substrate to add to a list of semiconductor substrates to be processed; and
assigning a first processing sequence to the first semiconductor substrate and a second processing sequence to the second semiconductor substrate.
12. The system of claim 11 , wherein generating the processing model for the batch of semiconductor substrates, comprises:
generating a processing model for the first semiconductor substrate and the second semiconductor substrate.
13. The system of claim 12 , further comprising:
identifying an additional semiconductor substrate in the batch to be processed;
upon identifying the additional semiconductor substrate, adding the additional semiconductor substrate to the list of substrates to be processed; and
generating a processing model for the list of semiconductor substrates to be processed.
14. The system of claim 8 , wherein generating a processing model for the batch of semiconductor substrates, comprises:
defining a sequence constraint for each processing chamber in the integrated substrate processing system.
15. A non-transitory computer readable medium having instructions stored thereon, which, when executed by a processor, cause the processor to perform a method of scheduling a semiconductor substrate processing sequence in an integrated substrate processing system, comprising:
assigning a processing sequence to each semiconductor substrate in a batch of semiconductor substrates to be processed;
for each processing chamber in the integrated substrate processing system, assigning a processing chamber to each process in the processing sequence;
generating a processing model for the batch of substrate, wherein the processing model define a start time for each substrate in each processing chamber;
generating a timetable for the batch of semiconductor substrates based off the processing model; and
processing the batch of semiconductor substrates in accordance with the timetable.
16. The non-transitory computer readable medium of claim 15 , wherein the processing sequence is the same for each semiconductor substrate in the batch.
17. The non-transitory computer readable medium of claim 15 , wherein the processing sequence is not the same for each semiconductor substrate in the batch.
18. The non-transitory computer readable medium of claim 17 , wherein assigning the processing sequence to each semiconductor substrate in the batch of semiconductor substrates to be processed, comprises:
selecting a first semiconductor substrate and a second semiconductor substrate to add to a list of semiconductor substrates to be processed; and
assigning a first processing sequence to the first semiconductor substrate and a second processing sequence to the second semiconductor substrate.
19. The non-transitory computer readable medium of claim 18 , wherein generating the processing model for the batch of semiconductor substrates, comprises:
generating a processing model for the first semiconductor substrate and the second semiconductor substrate.
20. The non-transitory computer readable medium of claim 19 , further comprising:
identifying an additional semiconductor substrate in the batch to be processed;
upon identifying the additional semiconductor substrate, adding the additional semiconductor substrate to the list of substrates to be processed; and
generating a processing model for the list of semiconductor substrates to be processed.