Probe and probe card including the same

1. A method comprising:

providing a device under test (DUT) to a test chamber;

performing testing on the DUT using a probe;

removing the DUT from the test chamber; and

packaging the DUT into a semiconductor package,

wherein the probe comprises:

a beam configured to transmit a test signal to the DUT, the beam extending in a length direction and having a first end portion and a second end portion aligned in the length direction; and

at least two tips disposed on the first end portion of the beam and configured to contact adjacent terminals of the DUT and transmit the test signal to the DUT,

wherein the at least two tips are arranged at an angle with respect to the length direction of the beam, and

wherein the at least two tips overlap one another in a second direction of the beam perpendicular to the length direction of the beam.

2. The method according to claim 1 , wherein the second direction is a width direction and the at least two tips are aligned with one another in the width direction of the beam.

3. The method according to claim 1 , wherein the at least two tips are offset in the length direction of the beam.

4. The method according to claim 1 , wherein the beam has a width exceeding a sum of diameters of the at least two tips.

5. The method according to claim 1 , further comprising:

at least two bases, each base being located between the beam and a corresponding one of the at least two tips.

6. The method according to claim 1 , further comprising:

a post on the second end portion of the beam opposite to the first end portion of the beam.

7. The method according to claim 1 , wherein the DUT includes a semiconductor chip, and

wherein the terminals of the DUT include power pads of the semiconductor chip.

8. The method according to claim 1 , wherein the DUT includes a semiconductor chip, and

wherein the terminals of the DUT include signal pads of the semiconductor chip to which test signals having a same waveform among the test signals are applied.

9. A method comprising:

providing a device under test (DUT) to a test chamber;

performing testing on the DUT using a probe card;

removing the DUT from the test chamber; and

packaging the DUT into a semiconductor package,

wherein the probe card comprises:

a printed circuit board (PCB) including a test pattern through which test signals for testing the DUT flow;

a first probe including:

a beam connected to the test pattern; and

at least two first tips arranged on the beam with respect to one another in a direction that is at a predetermined angle relative to a length direction of the beam and configured to contact power pads of the DUT; and

a second probe connected to the test pattern, the second probe including a second tip configured to contact a signal pad of the DUT,

wherein the at least two first tips overlap one another in a width direction of the beam, the width direction being perpendicular to the length direction of the beam.

10. The method according to claim 9 , wherein the at least two first tips are aligned with one another in the width direction of the beam.

11. The method according to claim 9 , wherein the beam has a width exceeding a sum of widths of the at least two first tips in the width direction of the beam perpendicular to the length direction of the beam.

12. The method according to claim 9 , wherein the probe card further comprises:

an interposer between the PCB and the first and second probes;

a first pogo pin configured to electrically connect the interposer to the test pattern of the PCB; and

a second pogo pin configured to electrically connect the interposer to the first and second probes.

13. The method according to claim 12 , wherein the probe card further comprises:

a probing plate below the second pogo pin, the probing plate including a probing pattern for electrically connecting the second pogo pin to the first and second probes.

14. The method according to claim 13 , wherein the probe card further comprises:

a support plate fixed to the PCB and configured to support the probing plate.

15. The method according to claim 13 , wherein the probe card further comprises:

a distance adjustment screw passing through the PCB to be connected to the probing plate, and wherein the distance adjustment screw is configured to adjust a distance between the PCB and the probing plate.

16. A method comprising:

providing a device under test (DUT) to a test chamber;

performing testing on the DUT using a probe card;

removing the DUT from the test chamber; and

packaging the DUT into a semiconductor package,

wherein the probe card comprises:

a printed circuit board (PCB) including a test pattern through which test signals for testing the DUT flow; and

a first probe including:

a beam connected to the test pattern; and

at least two first tips arranged on the beam with respect to one another in a direction at a predetermined angle relative to a length direction of the beam and configured to contact power pads of the DUT,

wherein the at least two first tips overlap one another in a width direction of the beam, the width direction being perpendicular to the length direction of the beam.

17. The method of claim 16 , wherein the probe card further comprises:

a second probe connected to the test pattern, the second probe including a second tip configured to contact a signal pad of the DUT.

18. The method of claim 17 , wherein the probe card further comprises:

an interposer between the PCB and the first and second probes;

a first pogo pin configured to electrically connect the interposer to the test pattern of the PCB; and

a second pogo pin configured to electrically connect the interposer to the first and second probes.

19. The method of claim 16 , wherein the at least two first tips are aligned with one another in the length direction of the beam.

20. The method of claim 16 , wherein the beam has a width exceeding a sum of widths of the at least two first tips in the width direction of the beam perpendicular to the length direction of the beam.