IP Library › Granted Patent US 10,475,838
Granted Patent B2
US 10,475,838 · App. 15/714,502 · Granted Nov 12, 2019

Multi-pixel detector and associated method for increasing angular sensitivity

Inventors: Chen-Wei Lu (San Jose, CA); Yin Qian (Milpitas, CA); Chin Poh Pang (Pleasanton, CA); Boyang Zhang (San Jose, CA)
Assignee: OmniVision Technologies, Inc.
H01L27/14627H01L27/14685H01L27/14621
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Quick Facts
Patent No.
US 10,475,838
App. No.
15/714,502
Granted
Nov 12, 2019
Kind
B2
Abstract

An image sensor includes a multi-pixel detector. The multi-pixel detector includes a first pixel formed in a substrate and having a first photodiode region, a second pixel formed in the substrate adjacent to the first pixel and having a second photodiode region, and a microlens above both the first pixel and the second pixel. The microlens includes (a) in a first cross-sectional plane perpendicular to a top surface of the substrate and including both the first and the second photodiode regions, a first height profile having N 1 local maxima, and (b) in a second cross-sectional plane perpendicular to the first cross-sectional plane and the top surface and including only one of the first and the second photodiode regions, a second height profile having N 2 >N 1 local maxima.

Claims (13)

1. An image sensor with a multi-pixel detector, comprising:

a first pixel formed in a substrate and having a first photodiode region;

a second pixel formed in the substrate adjacent to the first pixel and having a second photodiode region; and

a microlens above both the first pixel and the second pixel and having

(a) in a first cross-sectional plane perpendicular to a top surface of the substrate and including both the first and the second photodiode regions, a first height profile having N 1 local maxima, N 1 ≥1, and

(b) in a second cross-sectional plane perpendicular to the first cross-sectional plane and the top surface and including only one of the first and the second photodiode regions, a second height profile having N 2 >N 1 local maxima.

2. The image sensor of claim 1 ,

the first height profile having N 1 =1 local maxima and being characterized by first radius of curvature R 1 ; and

the second height profile including a first local maxima and a second local maxima corresponding to respective radii of curvature R 21 <R 1 and R 22 <R 1 .

3. The image sensor of claim 2 , the radius of curvature R 1 =730±70 nanometers.

4. The image sensor of claim 2 , the radii of curvature R 21 and R 22 being equal to within ten percent of (R 21 +R 22 )/2.

5. The image sensor of claim 2 , the radii of curvature R 21 and R 22 being equal to 580±60 nm.

6. The image sensor of claim 1 , the microlens having a maximum thickness of 730±70 nanometers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2017
From: LU, CHEN-WEI; QIAN, YIN; PANG, CHIN POH; ZHANG, BOYANG
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 043684/0108 →
Continuity (1)
Related Publication 20190096945A1 · Mar 28, 2019