IP Library Granted Patent US 10,056,157
Granted Patent B1
US 10,056,157 · App. 15/714,752 · Granted Aug 21, 2018

Memory apparatus with post package repair

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Quick Facts
Patent No.
US 10,056,157
App. No.
15/714,752
Granted
Aug 21, 2018
Kind
B1
Abstract

Apparatuses for memory repair for a memory device are described. An example apparatus includes: a non-volatile storage element that stores information; a storage latch circuit coupled to the non-volatile storage element and stores latch information; and a control circuit that, in a first repair mode, receives first repair address information, provides the first repair address information to the non-volatile storage element, and further transmits the first repair address information from the non-volatile storage element to the storage latch circuit. The control circuit, in a second repair mode, receives second repair address information and provides the second repair address information to the storage latch circuit and disables storing the second address information into the non-volatile storage element.

Claims (41)

1. A method comprising:

storing, in a first repair mode, first repair address information into a non-volatile storage element;

transferring, in the first repair mode, the first repair address information from the non-volatile storage element to a storage latch circuit; and

storing, in a second repair mode, second repair address information into the storage latch circuit without transferring the second repair address information to the non-volatile storage element.

2. The method of claim 1 , further comprising:

activating, in the first repair mode, a voltage generation circuit to generate a write voltage; and

deactivating, in the second repair mode, the voltage generation circuit not to generate the write voltage.

3. The method of claim 1 , further comprising:

storing first mode information into a mode register to be in the first repair mode when a first command is received; and

storing second mode information into the mode register to be in the second repair mode when a second command is received.

4. The method of claim 1 , further comprising:

storing, in each of the first repair mode and the second repair mode, enable information when the storage latch circuit stores corresponding one of the first repair address information and the second repair address information.

5. The method of claim 1 , further comprising:

electrically disconnecting, in the first repair mode, the storage latch circuit from the non-volatile storage element when storing the first repair address information into the non-volatile storage element.

6. The method of claim 1 , wherein a first period of time from receiving the first repair address information to storing the first repair address information into the storage latch circuit in the first repair mode is longer than a second period of time from receiving the second repair address information to storing the second repair address information into the storage latch circuit in the second repair mode.

7. The method of claim 1 , wherein the first repair mode is a post package repair mode and the second repair mode is a soft package repair mode.

8. A method comprising:

storing first repair address information into a first storage latch circuit;

storing first enable information responsive, at least in part, to the first repair address information being stored into the first storage latch circuit;

storing, in each of a first repair mode and a second repair mode, second repair address information into a second storage latch circuit responsive, at least in part, to the first enable information.

9. The method of claim 8 , further comprising:

storing, in the first repair mode, the second repair address information into a non-volatile storage element;

wherein the second repair address information stored into the non-volatile storage element is transferred to the second storage latch circuit in the first repair mode.

10. The method of claim 8 , wherein storing, in the second repair mode, the second repair address information into the second storage circuit is executed without transferring the second repair address information to a non-volatile storage element.

11. The method of claim 8 , wherein storing the first repair address information in the first storage latch circuit includes:

storing, in the first repair mode, the first repair address information into a non-volatile storage element;

transferring, in the first repair mode, the first repair address information from the non-volatile storage element to the first storage latch circuit.

12. The method of claim 8 , wherein storing the first repair address information in the first storage latch circuit includes:

storing, in second repair mode, the first repair address information into the first storage latch circuit without transferring the first repair address information into a non-volatile storage element.

13. The method of claim 9 , further comprising:

generating, in the first repair mode, a write voltage to store the second repair address information into the non-volatile storage element;

wherein the write voltage is not generated in the second repair mode.

14. The method of claim 8 , further comprising:

receiving address information;

comparing the address information to each of the first repair address information stored in the first storage latch circuit and the second repair address information stored in the second storage latch circuit.

15. The method of claim 8 , further comprising:

receiving, in the first repair mode, the first repair address information; and

receiving, in the second repair mode, the second repair address information;

wherein a first period of time from receiving the first repair address information to storing the first repair address information into the first storage latch circuit in the first repair mode is different from a second period of time from receiving the second repair address information to storing the second repair address information into the second storage latch circuit in the second repair mode.

16. The method of claim 15 , wherein the first period of time is longer than the second period of time.

17. The method of claim 8 , wherein the first repair mode is a post package repair mode and the second repair mode is a soft package repair mode.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
SUPPLEMENT NO. 6 TO PATENT SECURITY AGREEMENT Recorded Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2017
From: YOKO, HIDEYUKI
To: MICRON TECHNOLOGY, INC.
Reel/Frame 043685/0139 →