Semiconductor device and manufacturing method of the same
In order to improve reliability of a semiconductor device, the semiconductor device includes a semiconductor chip, a die pad, a plurality of leads, and a sealing portion. The die pad and the leads are made of a metal material mainly containing copper. A plating layer is formed on a top surface of the die pad. The plating layer is formed by a silver plating layer, a gold plating layer, or a platinum plating layer. The semiconductor chip is mounted on the plating layer on the top surface of the die pad via a bonding material. The plating layer is covered by the bonding material not to be in contact with the sealing portion.
1. A semiconductor device comprising:
a die pad having a main surface, a first plating layer formed on the main surface, and a back surface opposite the main surface;
a semiconductor chip having a front surface, a plurality of electrode pads formed on the front surface, and a rear surface opposite the front surface, and mounted on the main surface of the die pad via a first bonding material such that a first region of the main surface of the die pad is exposed from the semiconductor chip in plan view;
a plurality of leads arranged around the semiconductor chip in plan view, each of the plurality of leads having an upper surface on which a second plating layer is partially formed, and a lower surface opposite the upper surface;
a plurality of wires electrically connecting the plurality of electrode pads of the semiconductor chip with the plurality of leads, respectively, via the second plating layer; and
a sealing body sealing the semiconductor chip, at least a portion of the die pad, the plurality of wires and at least a portion of each of the plurality of leads,
wherein each of the die pad and the plurality of leads is made of a metal material mainly containing copper,
wherein each of the first plating layer and the second plating layer is made of one of silver, gold or platinum,
wherein the first plating layer is covered with the semiconductor chip such that the first plating layer is not exposed from the semiconductor chip in plan view,
wherein the first plating layer is covered with the first bonding material such that the first plating layer is not in contact with the sealing body,
wherein the semiconductor chip has a circuit forming region in which a plurality of semiconductor integrated circuits are formed, and
wherein the semiconductor chip is mounted on the die pad such that the circuit forming region of the semiconductor chip is located within an area in which the first plating layer is formed in plan view.
2. The semiconductor device according to claim 1 ,
wherein an area of the first plating layer is equal to or more than 70% of an area of the semiconductor chip in a plan view.
3. The semiconductor device according to claim 1 ,
wherein the first bonding material is formed of a conductive bonding material containing a conductive material and a resin material.
4. The semiconductor device according to claim 1 ,
wherein the first bonding material is formed of a sintered metal.
5. The semiconductor device according to claim 1 ,
wherein the back surface of the die pad is exposed from the sealing body.
6. The semiconductor device according to claim 1 ,
wherein the first region of the main surface of the die pad, in which no plating layer is formed, has a surface roughness rougher than a surface roughness of the first plating layer.
7. The semiconductor device according to claim 6 ,
wherein the first region of the main surface of the die pad, in which no plating layer is formed, has the surface roughness rougher than a surface roughness of a second region of each of the plurality of leads, which is exposed from the sealing body.
8. The semiconductor device according to claim 1 ,
wherein a region of the die pad, which is in contact with the sealing body, is roughened.
9. The semiconductor device according to claim 1 ,
wherein the first plating layer is a sliver layer.