SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM INCLUDING SEMICONDUCTOR DEVICE
In a first aspect of a present inventive subject matter, a semiconductor device includes a semiconductor layer including a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode that is positioned on the semiconductor layer. The semiconductor layer includes a surface area that is 3 mm 2 or less.
1 . A semiconductor device comprising:
a semiconductor layer comprising a crystalline oxide semiconductor that comprises gallium; and
a Schottky electrode that is positioned on the semiconductor layer;
wherein the semiconductor layer comprises a surface area that is 3 mm 2 or less.
2 . The semiconductor device according to claim 1 ,
wherein the Schottky electrode comprises at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table.
3 . The semiconductor device according to claim 1 ,
wherein the crystalline oxide semiconductor of the semiconductor layer comprises a corundum structure.
4 . The semiconductor device according to claim 1 ,
wherein the crystalline oxide semiconductor of the semiconductor layer comprises α-Ga 2 O 3 or a mixed crystal of α-Ga 2 O 3 .
5 . The semiconductor device according to claim 1 further comprising:
an ohmic electrode that comprises at least one metal selected from the fourth group or the eleventh group in the periodic table.
6 . The semiconductor device according to claim 1 , wherein
a capacitance of the semiconductor device with a zero-bias voltage is 500 pF or less when measured at 1 MHz.
7 . The semiconductor device according to claim 1 , wherein
the semiconductor device is configured to be activated by an electric current that is 1A or more.
8 . The semiconductor device according to claim 1 ,
wherein the semiconductor device is a power semiconductor device.
9 . The semiconductor device according to claim 1 ,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more.
10 . The semiconductor device according to claim 1 , wherein
the semiconductor layer comprises a first semiconductor layer and a second semiconductor layer, and
the Schottky electrode is positioned on the first semiconductor layer.
11 . The semiconductor device according to claim 10 , wherein
the first semiconductor layer with a first thickness and the second semiconductor layer with a second thickness are 40 μm or less as a total thickness of the first thickness of the first semiconductor layer and the second thickness of the second semiconductor layer,
12 . A semiconductor system comprising;
a motherboard; and
a semiconductor device according to claim 1 electrically connected to the motherboard.
13 . A semiconductor device comprising;
a semiconductor layer comprising a crystalline oxide semiconductor that comprises gallium; and
a Schottky electrode is positioned on the semiconductor layer,
wherein the semiconductor layer comprises a surface area that is 1 mm 2 or less.
14 . The semiconductor device according to claim 13 , wherein
the Schottky electrode comprises at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table.
15 . The semiconductor device according to claim 13 , wherein
the crystalline oxide semiconductor of the semiconductor layer comprises α-Ga 2 O 3 or a mixed crystal of α-Ga 2 O 3.
16 . The semiconductor device according to claim 13 ,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more.
17 . A semiconductor device comprising:
a semiconductor layer comprising a first semiconductor layer and a second semiconductor layer; and
a Schottky electrode being positioned on the first semiconductor layer, and the Schottky electrode comprising at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table, wherein
the first semiconductor layer comprises a crystalline oxide semiconductor comprising gallium,
the second semiconductor layer comprises a crystalline oxide semiconductor comprising gallium, and
at least one of the first semiconductor layer and the second semiconductor layer comprises a surface area that is 3 mm 2 or less.
18 . The semiconductor device according to claim 17 ,
wherein the first semiconductor layer with a first thickness and the second semiconductor layer with a second thickness are 40 μm or less as a total thickness of the first thickness of the first semiconductor layer and the second thickness of the second semiconductor layer.
19 . The semiconductor device according to claim 18 , wherein
the first semiconductor layer comprises a first carrier concentration, and the second semiconductor layer comprises a second carrier concentration, and
the first carrier concentration is smaller than the second carrier concentration.
20 . The semiconductor device according to claim 17 ,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more.