IP Library › Granted Patent US 10,593,053
Granted Patent B2
US 10,593,053 · App. 15/719,962 · Granted Mar 17, 2020

Projection pattern creation apparatus and three-dimensional measuring apparatus

Inventors: Shouta Takizawa (Yamanashi, JP); Junichirou Yoshida (Yamanashi, JP); Fumikazu Warashina (Yamanashi, JP)
Assignee: FANUC CORPORATION
G06T7/521G01B11/2513G06T5/006H04N9/3185H04N9/3194G06T2207/10152G06T2207/20008G06T2207/30208
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Quick Facts
Patent No.
US 10,593,053
App. No.
15/719,962
Granted
Mar 17, 2020
Kind
B2
Abstract

A projection pattern creation apparatus is configured to capture an image of a projection pattern projected from a pattern projection device by an imaging device to measure a three-dimensional position and/or a shape of an object. The projection pattern creation apparatus includes: a projection pattern deformation unit configured to reproduce deformation when a projected projection pattern is included in an image captured by the imaging device on the basis of characteristics of optical systems of the pattern projection device and the imaging device, and/or a positional relation between the pattern projection device and the imaging device and generate a deformation projection pattern; and a first projection pattern improvement unit configured to generate a second projection pattern obtained by improving a first projection pattern, on a basis of a first deformation projection pattern generated when the first projection pattern is projected toward evaluation surfaces having different positions and inclinations.

Claims (10)

1. A projection pattern creation apparatus configured to create a projection pattern used by a three-dimensional measuring apparatus comprising a pattern projection device and one or more imaging devices and configured to capture an image of a projection pattern projected to an object from the pattern projection device by the one or more imaging devices and measure a three-dimensional position and/or a shape of the object, the projection pattern creation apparatus comprising:

a projection pattern deformation unit configured to reproduce deformation when the projection pattern projected from the pattern projection device toward an evaluation surface provided in a projection range of the pattern projection device is included in an image captured by the one or more imaging devices, on the basis of characteristics of an optical system of the pattern projection device, characteristics of an optical system of the one or more imaging devices, and/or a positional relation between the pattern projection device and the one or more imaging devices and generate a deformation projection pattern; and

a first projection pattern improvement unit configured to generate a second projection pattern obtained by improving a first projection pattern, on a basis of one or more first deformation projection patterns generated when the first projection pattern is projected from the pattern projection device toward one or more evaluation surfaces having different positions and inclinations for the pattern projection device or the one or more imaging devices.

2. A three-dimensional measuring apparatus configured to project the second projection pattern from the pattern projection device, wherein the second projection pattern is created with the projection pattern creation apparatus according to claim 1 .

3. The projection pattern creation apparatus according to claim 1 , wherein:

the projection pattern deformation unit is configured to generate a first deformation projection pattern obtained by reproducing deformation of the projection pattern caused by the optical system of the pattern projection device and/or the optical system of the one or more imaging devices, and

the first projection pattern improvement unit is configured to calculate a first evaluation value on the basis of the first deformation projection pattern and improves the first projection pattern on the basis of the first evaluation value.

4. The projection pattern creation apparatus according to claim 1 , wherein:

the projection pattern deformation unit is configured to generate a second deformation projection pattern obtained by reproducing deformation of the projection pattern caused by a positional relation between the pattern projection device and the one or more imaging devices, and

the first projection pattern improvement unit is configured to calculate a first evaluation value on the basis of the second deformation projection pattern and improves the first projection pattern on the basis of the first evaluation value.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2017
From: TAKIZAWA, SHOUTA; YOSHIDA, JUNICHIROU; WARASHINA, FUMIKAZU
To: FANUC CORPORATION
Reel/Frame 043739/0492 →
Priority Claims (1)
JP 2016-198377 · Oct 6, 2016 · national
Continuity (1)
Related Publication 20180101962A1 · Apr 12, 2018