X-ray detector structure
An x-ray detector for obtaining x-ray images of an object is provided that is capable of increasing the ability of the detector to withstand shock and other types of forces acting on the enclosure to prevent and/or limit damage to the internal components of the detector. The enclosure includes an internal filler/force distribution layer formed from a lightweight, rigid material such as rigid foam and/or a suitable structure, such as a honeycomb or other lattice structure. The material is formed or shaped to fill a layer or portion of the interior of the detector that is otherwise empty space defined between the various internal components of the detector. The position and shape of the force distribution layer determines the path of load distribution across or through the enclosure away from the internal components of the detector and is optimized for shock absorption and/or load distribution.
1. An x-ray detector comprising:
an enclosure;
an imager disposed within the enclosure;
an electronics layer disposed within the enclosure and operably connected to the imager; and
at least one filler layer disposed within the enclosure and between the electronics layer and the enclosure, wherein the at least one filler layer includes a number of apertures formed therein, the apertures positioned over components of the electronics layer.
2. The detector of claim 1 , wherein the at least one filler layer is a material having a high compressive strength and a low density.
3. The detector of claim 2 , wherein the material forming the at least one filler layer has a compressive strength of between 60 psi-250 psi.
4. The detector of claim 2 , wherein the material forming the at least one filler layer has a density of between 3 lbs/ft 3 to 40 lbs/ft 3 .
5. The detector of claim 2 , wherein the material forming the at least one filler layer is a foam material.
6. The detector of claim 1 , wherein the electronics layer includes a circuit board on which the components are disposed, and wherein the at least one filler layer contacts the circuit board around the components.
7. The detector of claim 1 , wherein the at least one filler layer is formed of multiple materials.
8. The detector of claim 7 further comprising:
a first layer of a first material; and
a second layer of a second material, wherein the second layer is adjacent to the first layer.
9. The detector of claim 8 , wherein the first material and the second material have different compressive strength.
10. The detector of claim 8 , wherein the first layer at least partially overlays the second layer.
11. The detector of claim 1 , wherein the at least one filler layer fills an entire interior space within the enclosure between the electronics layer and the enclosure.
12. An x-ray detector comprising:
an enclosure;
an imager disposed within the enclosure;
an electronics layer disposed within the enclosure and operably connected to the imager; and
at least one filler layer disposed within the enclosure and between the electronics layer and the enclosure, the at least one filler layer comprising a first layer of a first material and a second layer of a second material, the second layer adjacent to the first layer,
wherein at least one of the first layer and the second layer includes a number of apertures therein.
13. The detector of claim 12 , wherein one of the first material and the second material is a cushioning material to optimize the shock absorption capability of the at least one filler layer.
14. A method for forming a detector for use in conjunction with an X-ray imaging system, the method comprising:
forming at least one filler layer of a high compressive strength, low density material, the at least one filler layer including a number of apertures extending at least partially through the at least one filler layer therein; and
positioning the at least one filler layer within an enclosure for the detector between an electronics layer and the enclosure in order to distribute forces acting on the detector through the detector.
15. The method of claim 14 , wherein the steps of forming the at least one filler layer and positioning the at least one filler layer within the enclosure are performed simultaneously.
16. The method of claim 14 , wherein the step of forming the at least one filler layer comprises:
forming a first layer;
forming a second layer; and
placing the first layer and the second layer adjacent to one another.
17. The method of claim 16 , wherein the step of first layer and the second layer to one another comprises additively manufacturing the first layer and the second layer.
18. The method of claim 16 , wherein the step of positioning the at least one filler layer comprises placing the number of apertures over components disposed on the electronics layer.
19. The method of claim 16 wherein the step of placing the first layer and the second layer adjacent to one another comprises attaching the first layer and the second layer to one another.