On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling
Embodiments of the invention are directed to a biosensing integrated circuit (IC). A non-limiting example of the biosensing IC includes a plurality of semiconductor substrate layers. A sensor element is formed over a first one of the plurality of semiconductor substrate layers, wherein the sensor element is configured to, based at least in part on the sensor element interacting with a predetermined material, generate data representing a measureable electrical parameter. An adhesion enhancement region is configured to physically couple the sensor element to the first one of the plurality of semiconductor substrate layers. In some embodiments of the invention, the biosensing IC further includes an electrically conductive interconnect network configured to communicatively couple the data representing the measureable electrical parameter to computer elements.
1. A biosensing integrated circuit (IC) apparatus comprising:
a plurality of semiconductor substrate layers;
a sensor element formed over a first one of the plurality of semiconductor substrate layers, wherein the sensor element is configured to, based at least in part on the sensor element interacting with a predetermined material, generate data representing a measureable electrical parameter; and
an adhesion enhancement region configured to physically couple the sensor element to the first one of the plurality of semiconductor substrate layers;
wherein the adhesion enhancement region comprises a protrusion configured to extend laterally with respect to a major surface of the first one of the plurality of semiconductor substrate layers; and
wherein the protrusion is further configured to extend laterally into a groove formed in a locking region of the first one of the plurality of semiconductor substrate layers.
2. The apparatus of claim 1 further comprising an electrically conductive interconnect network configured to communicatively couple the data representing the measureable electrical parameter to computer elements formed on a second one of the plurality of semiconductor substrate layers.
3. The apparatus of claim 2 further comprising:
a plurality of the sensor elements formed over the first one of the plurality of semiconductor substrate layers;
wherein the sensor element comprises a first one of the plurality of sensor elements and is configured to, based at least in part on the first one of the plurality of sensor elements interacting with a first predetermined material, generate first data representing a first measureable electrical parameter;
wherein a second one of the plurality of sensor elements is configured to, based at least in part on the second one of the plurality of sensor elements interacting with a second predetermined material, generate second data representing a second measureable electrical parameter;
wherein the electrically conductive interconnect network and the computing elements are configured to couple the first data and the second data to the computing elements separately;
wherein the computing elements are further configured to:
associate the first data to the first one of the plurality of sensors and analyze the first data separately from the second data; and
associate the second data to the second one of the plurality of sensors and analyze the second data separately from the first data.
4. The apparatus of claim 1 further comprising:
an optical element formed on:
the first one of the plurality of semiconductor substrate layers; or
a second one of the plurality of semiconductor substrate layers;
wherein the optical element is configured to, based at least in part on the optical element interacting optically with a predetermined material, generate data representing a measureable optical parameter.
5. The apparatus of claim 1 , wherein:
the sensor element comprises an electrode body;
the electrode body comprises at least one pillar; and
the at least one pillar comprises a glass-like carbon material.
6. The apparatus of claim 5 , wherein the at least one pillar comprises:
a height dimension comprising less than about 10 microns; and
a width dimension comprising less than about 1 microns.
7. The apparatus of claim 5 wherein the sensor element further comprises a recognition enhancement element coupled to the at least one pillar and configured to, based at least in part on the recognition enhancement element interacting with the predetermined material, assist with generating the data representing the measureable electrical parameter.