IP Library Granted Patent US 10,720,258
Granted Patent B2
US 10,720,258 · App. 15/723,643 · Granted Jul 21, 2020

Method for manufacturing a conductive wire

Inventors: Seigi Aoyama (Tokyo, JP); Toru Sumi (Tokyo, JP); Takashi Hayasaka (Tokyo, JP); Ryohei Okada (Tokyo, JP); Detian Huang (Tokyo, JP); Tamotsu Sakurai (Tokyo, JP); Satoshi Yajima (Hitachi, JP); Minoru Takatsuto (Hitachi, JP); Hiroshi Bando (Hitachi, JP)
Assignee: HITACHI METALS, LTD.
H01B1/026B22D11/003C22F1/08H01B11/1808H01B13/0162
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Quick Facts
Patent No.
US 10,720,258
App. No.
15/723,643
Granted
Jul 21, 2020
Kind
B2
Abstract

A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

Claims (12)

1. A method for manufacturing a conductive wire, comprising:

conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element;

reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter;

heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating; and

reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

2. The method according to claim 1 , wherein the heat treatment is performed such that a diffraction image with a circular spot is observed in a metal structure of the conductive wire with secondary diameter.

3. The method according to claim 1 , wherein the conductive alloy material comprises a copper-based alloy material, a silver-based alloy material or a nickel-based alloy material.

4. The method according to claim 3 , wherein the copper-based material comprises a Cu—Ag alloy, a Cu—Sn alloy, a Cu—Sn—In alloy, a Cu—Sn—Mg alloy or a Cu—Mg alloy.

5. The method according to claim 3 , wherein the silver-based material comprises an Ag—Cu alloy.

6. The method according to claim 3 , wherein the nickel-based material comprises a Ni—Cu alloy.

7. The method according to claim 1 , wherein the tertiary diameter is not less than 13 μm and not more than 40 μm.

8. A method for manufacturing a cable, comprising a conductive wire that is manufactured by the method according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2017
From: AOYAMA, SEIGI; SUMI, TORU; HAYASAKA, TAKASHI; OKADA, RYOHEI; HUANG, DETIAN; SAKURAI, TAMOTSU; YAJIMA, SATOSHI; TAKATSUTO, MINORU; BANDO, HIROSHI
To: HITACHI METALS, LTD.
Reel/Frame 043768/0714 →
Priority Claims (1)
JP 2017-002192 · Jan 10, 2017 · national
Continuity (1)
Related Publication 20180197652A1 · Jul 12, 2018