Semiconductor device with dummy hole
A semiconductor device may include a base substrate, a first thin-film transistor (“TFT”) provided on the base substrate, a second TFT provided on the base substrate, and a plurality of insulating layers provided on the base substrate to define at least one dummy hole that is not overlapped with the first and second TFTs. The first TFT may include a first input electrode, a first output electrode, a first control electrode, and a first semiconductor pattern including a crystalline semiconductor material, and the second TFT may include a second input electrode, a second output electrode, a second control electrode, and a second semiconductor pattern including an oxide semiconductor material. A shortest distance between the at least one dummy hole and the second semiconductor pattern may be equal to or shorter than 5 micrometers (μm), in a plan view.
1. A semiconductor device, comprising:
a base substrate;
a plurality of gate lines;
a first thin-film transistor which is provided on the base substrate, and includes a first input electrode, a first output electrode, a first control electrode, and a first semiconductor pattern including a crystalline semiconductor material;
a second thin-film transistor which is provided on the base substrate, and includes a second input electrode, a second output electrode, a second control electrode directly connected to a gate line of the plurality of gate lines, and a second semiconductor pattern including an oxide semiconductor material; and
a plurality of insulating layers provided on the base substrate to define at least one dummy hole which is not overlapped with the first and second thin-film transistors,
wherein the plurality of insulating layers comprises a first insulating layer provided on the first semiconductor pattern and below the second semiconductor pattern;
wherein a shortest distance between the at least one dummy hole and the second semiconductor pattern is equal to or shorter than 5 micrometers, in a plan view, and
wherein the at least one dummy hole is not filled with a conductive material and provided to meet following inequality 1:
2 micrometers×2 micrometers≤ X micrometer 2 ≤2 micrometers× Y micrometer, [Inequality 1]
where X is a total planar area of the at least one dummy hole, and
Y is a length of the second semiconductor pattern, wherein Y is equal to or shorter than about 20 micrometers.
2. The semiconductor device of claim 1 , wherein the shortest distance is equal to or shorter than 2.5 micrometers.
3. The semiconductor device of claim 1 , wherein at least a portion of the at least one dummy hole is filled with an insulating material.
4. The semiconductor device of claim 1 , wherein the plurality of insulating layers further comprises:
a second insulating layer provided on the second semiconductor pattern,
wherein the at least one dummy hole is defined to penetrate the first insulating layer and the second insulating layer.
5. The semiconductor device of claim 4 , wherein the first insulating layer has a multi-layered structure.
6. The semiconductor device of claim 1 , wherein the first input electrode and the first output electrode are in contact with the first semiconductor pattern via a first through hole and a second through hole, respectively, and
the second input electrode and the second output electrode are in contact with the second semiconductor pattern via a third through hole and a fourth through hole, respectively.
7. The semiconductor device of claim 6 , wherein a distance between a bottom end of the at least one dummy hole and a top surface of the base substrate is smaller than a distance between a bottom end of each of the first, second, third, and fourth through holes and the top surface of the base substrate.
8. The semiconductor device of claim 1 , wherein a length of a channel region of the second semiconductor pattern is equal to or shorter than 2 micrometers.
9. The semiconductor device of claim 1 , further comprising a light-emitting diode connected to the first thin-film transistor.
10. The semiconductor device of claim 1 , further comprising:
a plurality of data lines; and
wherein the second input electrode directly connected to a data line of the plurality of data lines.
11. A semiconductor device, comprising:
a base substrate;
a plurality of gate lines;
a first thin-film transistor which is provided on the base substrate, and includes a first input electrode, a first output electrode, a first control electrode, and a first semiconductor pattern including a crystalline semiconductor material;
a second thin-film transistor which is provided on the base substrate, and includes a second input electrode, a second output electrode, a second control electrode directly connected to a gate line of the plurality of gate lines, and a second semiconductor pattern including an oxide semiconductor material; and
a first insulating layer provided on the first semiconductor pattern and below the second semiconductor pattern; and
a second insulating layer provided on the second semiconductor pattern, wherein at least one dummy hole is defined to penetrate through the first insulating layer and the second insulating layer, and
in a plan view, the at least one dummy hole is not overlapped with the first and second thin-film transistors and is closer to the second semiconductor pattern than to the first semiconductor pattern, and
wherein the at least one dummy hole is not filled with a conductive material and provided to meet following inequality 1:
2 micrometers×2 micrometers≤ X micrometer 2 ≤2 micrometers× Y micrometer,[Inequality 1]
where X is a total planar area of the at least one dummy hole, and
Y is a length of the second semiconductor pattern, wherein Y is equal to or shorter than about 20 micrometers.
12. The semiconductor device of claim 11 , wherein the first input electrode and the first output electrode are in contact with the first semiconductor pattern via a first through hole and a second through hole, respectively,
the second input electrode and the second output electrode are in contact with the second semiconductor pattern via a third through hole and a fourth through hole, respectively, and
a distance between a bottom end of the at least one dummy hole and a top surface of the base substrate is shorter than a distance between a bottom end of each of the first, second, third, and fourth through holes and the top surface of the base substrate.
13. The semiconductor device of claim 11 , wherein at least a portion of the at least one dummy hole is filled with an insulating material.
14. The semiconductor device of claim 11 , wherein a shortest distance between the at least one dummy hole and the second semiconductor pattern is equal to or shorter than 5 micrometers, in the plan view.
15. The semiconductor device of claim 11 , wherein a shortest distance between the at least one dummy hole and the second semiconductor pattern is equal to or shorter than 2.5 micrometers, in the plan view.
16. The semiconductor device of claim 11 , wherein the first insulating layer has a multi-layered structure.
17. The semiconductor device of claim 11 , wherein a length of a channel region of the second semiconductor pattern is equal to or shorter than 2 micrometers.
18. The semiconductor device of claim 11 , further comprising:
a plurality of data lines; and
wherein the second input electrode directly connected to a data line of the plurality of data lines.