IP Library Granted Patent US 10,918,771
Granted Patent B2
US 10,918,771 · App. 15/725,750 · Granted Feb 16, 2021

Methods and devices for applying closed incision negative pressure wound therapy

Inventors: Kenneth Wu (San Francisco, CA); Dean Hu (San Leandro, CA); Sumona Nag (Los Angeles, CA)
Assignee: KCI Licensing, Inc.
A61M1/0088A61B17/085A61M1/009A61M1/0096A61M27/00A61F2013/00536A61M1/0076
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Quick Facts
Patent No.
US 10,918,771
App. No.
15/725,750
Granted
Feb 16, 2021
Kind
B2
Abstract

Disclosed herein are devices, systems and methods for using such devices and systems for treating incisions and wounds. In an aspect, disclosed is a device having a generally planar tension relief module and a flexible sealant structure sized to cover the tension relief module, the flexible sealant structure comprising a lower adhesive surface. The tension relief module includes a conduit structure having a plurality of support structures on an upper surface of the conduit structure and at least one opening extending through the conduit structure from a lower surface to the upper surface. At least a portion of the conduit structure is adapted to be aligned with a longitudinal axis of the incision. The tension relief module also includes opposing adhesive structures coupled to the conduit structure. The lower adhesive surface of the flexible sealant structure and the upper surface of the conduit structure form a flow pathway.

Claims (44)

1. A device for treating an incision, the device comprising:

a tension relief module, comprising:

a conduit structure forming an internal lumen, the conduit structure comprising:

an upper surface,

a lower surface, and

at least one opening extending through the lower surface and the upper surface, wherein the at least one opening is configured to provide fluid communication between the upper surface of the conduit structure and the incision;

opposing adhesive structures coupled to the conduit structure, wherein the opposing adhesive structures are configured to be manually stretched in a direction perpendicular to the internal lumen from a relaxed configuration to a first tensile configuration to adhere to tissue substantially perpendicular to a length of the incision; and

a flexible sealant structure comprising a lower adhesive surface and configured to cover the tension relief module, wherein the lower adhesive surface of the flexible sealant structure and the upper surface of the conduit structure are configured to form a flow pathway.

2. The device of claim 1 , wherein the flexible sealant structure further comprises a vacuum port in fluid communication with the flow pathway and configured to be coupled to a negative pressure source.

3. The device of claim 2 , further comprising a one-way flow valve positioned between the negative pressure source and the flow pathway, the one-way flow valve configured to prevent backflow of fluid within the flow pathway.

4. The device of claim 2 , wherein the flexible sealant structure further comprises a release liner adhered to the lower adhesive surface.

5. The device of claim 4 , wherein the release liner further comprises a break line positioned near the vacuum port.

6. The device of claim 1 , further comprising a first mating end and a second mating end, the first mating end configured to mate with a second mating end of another conduit structure, and wherein the second mating end is configured to mate with a first mating end of another conduit structure.

7. The device of claim 6 , further comprising at least one of a first tension relief module configured to mate with the tension relief module at the first mating end or a second tension relief module configured to mate with the tension relief module at the second mating end.

8. The device of claim 1 , wherein the opposing adhesive structures are adapted to return towards the relaxed configuration from the first tensile configuration into a second tensile configuration such that the opposing adhesive structures impart a contracting force towards a center of the incision.

9. A device for treating an incision, the device comprising:

a tension relief module, comprising:

a conduit structure comprising:

an upper surface extending along a length of the conduit structure,

a lower surface extending along the length of the conduit structure,

a plurality of support structures extending from one of the upper surface or the lower surface or both the upper surface and the lower surface, and

at least one opening extending through the lower surface and the upper surface, wherein the at least one opening is configured to provide fluid communication between the upper surface of the conduit structure and the incision; and

opposing adhesive structures coupled to the conduit structure along the length of the conduit structure, wherein the opposing adhesive structures are configured to be manually stretched in a direction perpendicular to the length of the conduit structure from a relaxed configuration to a first tensile configuration to adhere to tissue substantially perpendicular to a length of the incision.

10. The device of claim 9 , further comprising a flexible sealant structure sized to cover the tension relief module, wherein the flexible sealant structure comprises a lower adhesive surface, and wherein the lower adhesive surface of the flexible sealant structure and the upper surface of the conduit structure form a flow pathway.

11. The device of claim 10 , wherein the flexible sealant structure further comprises a vacuum port in fluid communication with the flow pathway and configured to be coupled to a negative pressure source.

12. The device of claim 11 , further comprising a one-way flow valve positioned between the negative pressure source and the flow pathway, the one-way flow valve configured to prevent backflow of fluid within the flow pathway.

13. The device of claim 11 , wherein the flexible sealant structure further comprises a release liner adhered to the lower adhesive surface.

14. The device of claim 13 , wherein the release liner further comprises a break line positioned near the vacuum port.

15. The device of claim 9 , further comprising a first mating end and a second mating end, the first mating end configured to mate with a second mating end of another conduit structure, and wherein the second mating end is configured to mate with a first mating end of another conduit structure.

16. The device of claim 15 , further comprising at least one of a first tension relief module configured to mate with the tension relief module at the first mating end or a second tension relief module configured to mate with the tension relief module at the second mating end.

17. The device of claim 9 , wherein the opposing adhesive structures are adapted to return towards the relaxed configuration from the first tensile configuration into a second tensile configuration such that the opposing adhesive structures impart a contracting force towards a center of the incision.

18. A system for treating an incision, the system comprising:

a device comprising a tension relief module, wherein the tension relief module comprises:

a conduit structure having an upper surface extending along a length of the conduit structure, a lower surface extending along the length of the conduit structure, and at least one opening extending through the lower surface and the upper surface, and

opposing adhesive structures coupled to the conduit structure along the length of the conduit structure, wherein the opposing adhesive structures are configured to be stretched in a direction perpendicular to the length of the conduit structure from a relaxed configuration to a first tensile configuration to adhere to tissue substantially perpendicular to a length of the incision;

a flexible sealant structure comprising a lower adhesive surface and configured to be positioned over the tension relief module; and

a negative pressure source configured to provide to negative pressure to the incision through a flow pathway between the lower adhesive surface of the flexible sealant structure and the upper surface of the conduit structure.

19. The system of claim 18 , wherein the flexible sealant structure further comprises a vacuum port in fluid communication with the flow pathway and configured to be coupled to the negative pressure source.

20. The system of claim 19 , wherein the device further comprises a one-way flow valve positioned between the negative pressure source and the flow pathway, the one-way flow valve configured to prevent backflow of fluid within the flow pathway.

21. The system of claim 19 , wherein the flexible sealant structure further comprises a release liner adhered to a lower adhesive surface of the flexible sealant structure.

22. The system of claim 21 , wherein the release liner further comprises a break line positioned near the vacuum port.

23. The system of claim 18 , wherein a first mating end is configured to mate with a second mating end of another conduit structure, and wherein the second mating end is configured to mate with a first mating end of another conduit structure.

24. The system of claim 23 , wherein the device further comprises at least one of a first tension relief module configured to mate with the tension relief module at the first mating end or a second tension relief module configured to mate with the tension relief module at a second mating end.

25. The device of claim 23 , wherein the opposing adhesive structures are adapted to return towards the relaxed configuration from the first tensile configuration into a second tensile configuration such that the opposing adhesive structures impart a contracting force towards a center of the incision.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2024
From: 3M INNOVATIVE PROPERTIES COMPANY
To: SOLVENTUM INTELLECTUAL PROPERTIES COMPANY
Reel/Frame 066443/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2023
From: KCI LICENSING, INC.
To: 3M INNOVATIVE PROPERTIES COMPANY
Reel/Frame 064730/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2020
From: WU, KENNETH; HU, DEAN; NAG, SUMONA
To: SPIRACUR, INC.
Reel/Frame 052293/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2020
From: SPIRACUR, INC.
To: KCI LICENSING, INC.
Reel/Frame 052294/0187 →
Continuity (7)
Continuation 14727733 · Jun 1, 2015
Continuation 13783150 · Mar 1, 2013
Continuation 12890399 · Sep 24, 2010
Continuation In Part 12757654 · Apr 9, 2010
Provisional Application 61372443 · Aug 10, 2010
Provisional Application 61168507 · Apr 10, 2009
Related Publication 20180104393A1 · Apr 19, 2018