Semiconductor image sensor device having back side illuminated image sensors with embedded color filters
Disclosed is a method of fabricating a semiconductor image sensor device. The method includes providing a substrate having a pixel region, a periphery region, and a bonding pad region. The substrate further has a first side and a second side opposite the first side. The pixel region contains radiation-sensing regions. The method further includes forming a bonding pad in the bonding pad region; and forming light-blocking structures over the second side of the substrate, at least in the pixel region, after the bonding pad has been formed.
1. A device comprising:
a substrate having a first side and a second side that is opposite the first side;
an interconnect structure in contact with the first side of the substrate;
a pixel disposed in the substrate;
a radiation-blocking structure disposed over the second side of the substrate, the radiation-blocking structure defining a recess;
a passivation layer disposed in the recess;
a color filter disposed in the recess, wherein the passivation layer is disposed within the recess between the color filter and the radiation-blocking structure; and
a shallow trench isolation structure disposed within the substrate, and
wherein the passivation layer extends to the shallow trench isolation structure disposed within the substrate.
2. The device of claim 1 , wherein the passivation layer disposed in the recess has a first sidewall and opposing second sidewall and the color filter extends from the first sidewall to the second sidewall.
3. The device of claim 1 , wherein the pixel is closer to the first side of the substrate than the second side of the substrate.
4. The device of claim 1 , further comprising:
an antireflective layer disposed over the second side of the substrate, and
a buffer layer disposed over the antireflective layer.
5. The device of claim 1 , wherein the radiation-blocking structure has a top surface facing away from the substrate, and
wherein a portion of the passivation layer physically contacts the top surface of the radiation-blocking structure.
6. The device of claim 1 , wherein the radiation-blocking structure includes a first portion and a second portion and wherein the pixel is disposed within the substrate between the first and second portions of the radiation-blocking structure.
7. The device of claim 1 , further comprising a conductive pad disposed on a portion of the interconnect structure, and
wherein the passivation layer extends continuously from over the second side of the substrate to the conductive pad.
8. A device comprising:
a substrate having a front side and a back side that is opposite the front side;
an interconnect structure in contact with the front side of the substrate;
a pixel disposed in the substrate;
a light-reflective structure disposed over the back side of the substrate, the light-reflective structure defining a recess;
a color filter disposed in the recess;
a passivation layer disposed in the recess; and
a conductive pad disposed on a portion of the interconnect structure, and
wherein the passivation layer extends continuously from over the back side of the substrate to the conductive pad.
9. The device of claim 8 , wherein the light-reflective structure includes a first portion and a second portion such that the recess extends between the first and second portions of the light-reflective structure.
10. The device of claim 9 , further comprising another pixel disposed in the substrate, and
wherein at least one of the first and second portions of the light-reflective structure is disposed directly over the another pixel.
11. The device of claim 8 , wherein the substrate has a sidewall extending from the front side to the back side of the substrate, and
wherein the passivation layer is disposed along and physically contacts the sidewall of the substrate.
12. The device of claim 11 , wherein the light-reflective structure has another sidewall that is vertically aligned with the sidewall of the substrate, and
wherein the passivation layer is disposed along and physically contacts the another sidewall of the light-reflective structure.
13. The device of claim 8 , wherein the light-reflective structure has opposing sidewalls and the passivation layer physically contacts both sidewalls of the light-reflective structure.
14. The device of claim 8 , further comprising a shallow trench isolation structure disposed within the substrate, and
wherein the passivation layer extends to the shallow trench isolation structure disposed within the substrate.
15. A device comprising:
a substrate having a first side and a second side that is opposite the first side, the substrate further including a sidewall extending from the first side to the second side of the substrate;
an interconnect structure in contact with the first side of the substrate;
a pixel disposed in the substrate;
a conductive pad disposed directly on a portion of the interconnect structure;
a radiation-blocking structure disposed over the second side of the substrate, wherein the radiation-blocking structure includes a first portion and a second portion and wherein the pixel is disposed within the substrate between the first and second portions of the radiation-blocking structure; and
a passivation layer disposed over the second side of the substrate and over the radiation-blocking structure and extending along the sidewall of the substrate, wherein at least a portion of the passivation layer is disposed over the conductive pad.
16. The device of claim 15 , further comprising:
an antireflective layer disposed over and physically contacting the second side of the substrate, and
a buffer layer disposed over the antireflective layer and physically contacting the antireflective layer, and
wherein the radiation-blocking structure is disposed over and physically contacts the buffer layer.
17. The device of claim 16 , wherein the passivation layer is disposed over and physically contacts the buffer layer.
18. The device of claim 15 , further comprising a dielectric isolation structure disposed within the substrate, and
wherein the conductive pad physically contacts the dielectric isolation structure disposed within the substrate.
19. The device of claim 18 , wherein the passivation layer extends physically contacts the dielectric isolation structure disposed within the substrate.
20. The device of claim 15 , further comprising a color filter disposed in a recess defined by the radiation-blocking structure, and
wherein the passivation layer is disposed within the recess between the color filter and the radiation-blocking structure.