Catalyst
Catalyst comprising an Ir layer having an outer layer with a layer comprising Pt directly thereon, wherein the Ir layer has an average thickness in a range from 0.04 to 30 nanometers, wherein the layer comprising Pt has an average thickness in a range from 0.04 to 50 nanometers, and wherein the Pt and Ir are present in an atomic ratio in a range from 0.01:1 to 10:1. Catalysts described herein are useful, for example, in fuel cell membrane electrode assemblies.
1. A catalyst comprising an Ir layer having an outer layer with a layer comprising Pt directly thereon, wherein the Ir layer has an average thickness in a range from 0.04 to 30 nanometers, wherein the layer comprising Pt has an average thickness in a range from 0.04 to 50 nanometers, wherein the average thickness of the catalyst is the sum of the average thickness of the Ir layer and the average thickness of the layer comprising Pt, wherein the Pt and Ir are present in an atomic ratio in a range from 0.01:1 to 10:1, and wherein the catalyst further comprises nanoscopic metal crystallites extending from the surface of the catalyst.
2. The catalyst of claim 1 , wherein the surface metal crystallites comprise at least 10 atomic % Ir.
3. The catalyst of claim 1 , wherein the surface metal crystallites have a length in a range from 0.25 to 10 nanometers.
4. The catalyst of claim 1 , wherein the surface metal crystallites have diameters in a range from 0.25 to 5 nanometers.
5. The catalyst of claim 1 , wherein the layer comprising Pt further comprises Ni.
6. The catalyst of claim 5 , wherein the Pt to Ni atomic ratio is in a range from 0.5:1 to 5:1.
7. An article comprising nanostructured elements comprising microstructured whiskers having an outer surface having the catalyst of claim 1 thereon.
8. The article of claim 7 , wherein the microstructured whiskers are attached to a backing.
9. An article comprising the catalyst of claim 8 .
10. The article according to claim 9 which comprises no electrically conductive carbon-based material.
11. A method of making the catalyst of claim 1 , the method comprising depositing any of the layers via a deposition technique independently selected from the group consisting of sputtering, atomic layer deposition, metal organic chemical vapor deposition, molecular beam epitaxy, ion soft landing, thermal physical vapor deposition, vacuum deposition by electrospray ionization, and pulse laser deposition.
12. The method of claim 11 , further comprising annealing at least one of the layers.