IP Library Granted Patent US 11,143,827
Granted Patent B1
US 11,143,827 · App. 15/734,103 · Granted Oct 12, 2021

Light receiving element unit

Inventors: Yu Itazaki (Kyoto, JP); Etsuji Omura (Kyoto, JP)
Assignee: Kyoto Semiconductor Co., Ltd.
G02B6/4214G02B6/4243H01L25/043
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Quick Facts
Patent No.
US 11,143,827
App. No.
15/734,103
Granted
Oct 12, 2021
Kind
B1
Abstract

An edge incident type light receiving element unit capable of receiving optical signals in different wavelength ranges incident from the edge side comprises a first light receiving element for receiving optical signals in a first wavelength range and a second light receiving element for receiving optical signals in a second wavelength range, and configured so that optical signals transmitted through a first light receiving portion formed vertically on a wall portion of a first semiconductor substrate incident via a reflecting portion on a second light receiving portion formed on a second semiconductor substrate fitted on the first semiconductor substrate.

Claims (9)

1. A light receiving element unit comprising a first light receiving element having a first light receiving photodiode for receiving optical signals in a first wavelength range and a second light receiving element having a second light receiving photodiode for receiving optical signals in a second wavelength range, and configured so that optical signals transmitted through the first light receiving photodiode are incident on the second light receiving photodiode; wherein

the first light receiving element comprises a first semiconductor substrate, a wall portion erected integrally with the first semiconductor substrate, and the first light receiving photodiode formed on the wall portion,

the second light receiving element is an edge incident type light receiving element comprising a second semiconductor substrate, the second light receiving photodiode formed on a main surface side of the second semiconductor substrate, a reflecting portion that reflects optical signals incident from an edge surface of the second semiconductor substrate toward the second light receiving photodiode, and

the second light receiving element is arranged so that the edge surface faces the wall portion.

2. The light receiving element unit according to claim 1 ; wherein the first light receiving element comprises a first accommodating portion adjacent to the wall portion and formed by reducing a thickness of the first semiconductor substrate by a height of the wall portion, and

the second light receiving element is accommodated in the first accommodating portion.

3. The light receiving element unit according to claim 1 or 2 ; wherein the first light receiving element comprises a second accommodating portion adjacent to the wall portion and formed by reducing the thickness of the first semiconductor substrate by the height of the wall portion, and

an optical fiber cable for emitting optical signals toward the first light receiving photodiode is accommodated in the second accommodating portion.

4. The light receiving element unit according to claim 3 ; wherein the second accommodating portion is formed to be a groove shape for fixing the optical fiber cable.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2024
From: DEXERIALS PHOTONICS SOLUTIONS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 068013/0329 →
CHANGE OF NAME Recorded Jun 26, 2024
From: KYOTO SEMICONDUCTOR CO., LTD.
To: DEXERIALS PHOTONICS SOLUTIONS CORPORATION
Reel/Frame 067877/0479 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2020
From: ITAZAKI, YU; OMURA, ETSUJI
To: KYOTO SEMICONDUCTOR CO., LTD.
Reel/Frame 054681/0774 →