Manufacturing method of TFT substrate, TFT substrate, and OLED display panel
This disclosure discloses a manufacturing method of a TFT substrate, a TFT substrate, and an OLED display panel. The manufacturing method of the TFT substrate includes sequentially forming a gate electrode, a gate insulating layer, a polysilicon layer, and a barrier layer on the substrate, the polysilicon layer including a source region, a drain region, and a channel region; the barrier layer above the source and drain regions is etched by a photomask so that the thickness of the barrier layer allows ions to pass through and is not zero; and then the polysilicon layer is ion implanted; through the method, the polysilicon layer of the source and drain regions can be ion implanted without exposing the polysilicon layer, the damage of the polysilicon layer during the process can be avoided, and the stability of the TFT substrate can be improved, thereby improving the display quality.
1. A manufacturing method of a TFT substrate, comprising:
sequentially forming a gate electrode, a gate insulating layer, a polysilicon layer, and a barrier layer on a substrate, wherein the polysilicon layer comprises a source region, a drain region, and a channel region;
etching the barrier layer located on the source and drain regions through a first photomask so that thickness of the barrier layer on the source and drain regions is that ions can pass through and is not zero;
performing ion implantation to the polysilicon layer of the source and drain regions;
patterning the barrier layer on the source and drain regions through a second photomask to form first contact holes on the barrier layer on the source and drain regions respectively;
forming a source electrode and a drain electrode on the barrier layer, wherein the source and drain electrodes are connected to the polysilicon layer of the source and drain regions by passing through the first contact holes.
2. The manufacturing method according to claim 1 , wherein etching of the barrier layer located on the source and drain regions through the first photomask comprises:
making thickness of the barrier layer on the channel region after etching to be larger than that of the barrier layer on the source and drain regions through the first photomask, and making thickness of the barrier layer on the channel region after etching to be that ions cannot pass through.
3. The manufacturing method according to claim 2 , wherein ion implantation to the polysilicon layer of the source and drain regions comprising:
performing an ion implantation to the TFT substrate, ions located above the source and drain regions pass through the barrier layer on the source and drain regions and dope into the polysilicon layer of the source and drain regions, and ions located above the channel region are blocked by the barrier layer on the channel region.
4. The manufacturing method according to claim 1 , wherein patterning of the barrier layer on the source and drain regions through the second photomask to form first contact holes on the barrier layer on the source and drain regions respectively, comprising:
patterning the barrier layer on the source and drain regions and the ion-implanted polysilicon layer through the second photomask to form the first contact holes in the patterned area of the barrier layer and the polysilicon layer.
5. The manufacturing method according to claim 1 , wherein patterning of the barrier layer on the source and drain regions through the second photomask to form the first contact holes on the barrier layer on the source and drain regions respectively, further comprising:
patterning the barrier layer disposed outside the polysilicon layer through the second photomask to form a second contact hole on the barrier layer disposed outside the polysilicon layer;
wherein the second contact hole is used to connect the metal wire in the same layer as the gate electrode to the metal wire in the same layer as the source and drain electrodes, and the metal wire in the same layer as the gate electrode is located below the barrier layer disposed outside the polysilicon layer.
6. The manufacturing method according to claim 1 , wherein thickness of the polysilicon layer is less than or equal to that of the gate insulating layer.
7. The manufacturing method according to claim 1 , wherein thickness of the barrier layer on the source and drain regions is between 450 Å and 550 Å, and thickness of the barrier layer on the channel region after etching through the first photomask is the same as that before etching.
8. The manufacturing method according to claim 1 , wherein bottom of the first contact holes expose the gate insulating layer.