IP Library Granted Patent US 11,059,072
Granted Patent B2
US 11,059,072 · App. 15/737,728 · Granted Jul 13, 2021

Screen plate for screening plants for mechanical classification of polysilicon

Inventors: Andreas Bergmann (Kastl, DE); Thomas Buschhardt (Burghausen, DE); Simon Ehrenschwendtner (Winhoering, DE); Christian Fraunhofer (Mitterskirchen, DE)
Assignees: SILTRONIC AG; WACKER CHEMIE AG
B07B13/07B07B1/12B07B1/28B07B1/46
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Quick Facts
Patent No.
US 11,059,072
App. No.
15/737,728
Granted
Jul 13, 2021
Kind
B2
Abstract

Polysilicon chunks or granules are classified into size fractions using a mechanical screen having a profiled surface having peaks and valleys, and terminating in widening slots through which a polysilicon size fraction falls. The device is effective and the slots are resistant to clogging.

Claims (17)

1. A profiled screen plate for removal of polysilicon fines from larger chunks of polysilicon in a screening plant for the mechanical classification of polysilicon, the screen plate comprising:

a feed region for receiving a feed of polysilicon, a profiled region having peaks and valleys, and a region having slots which follow on from the valleys, and a takeoff region, wherein the slots increase in size toward the direction of the takeoff region, and wherein the peaks of the profiled region continue into the region having slots so that the entire screen plate is profiled such that the height of the peaks and valleys extending across the profiled region to the end of the takeoff region are constant, the screen plate having slots instead of valleys at its end in the direction of conveyance, the height of the peaks and the maximum width of the slots in the takeoff region configured such that a fines fraction of polysilicon chunks is removed from the feed of polysilicon, wherein the fines fraction removed is defined as silicon chunks which can pass through a mesh screen having square mesh apertures of 8 mm×8 mm in size when chunks having chunk sizes of 20 mm to 250 mm are being classified, and is defined as silicon chunks which can pass through a mesh screen having square mesh apertures of 1 mm×1 mm when chunks having chunk sizes of 0.1 to 5 mm are being classified.

2. The screen plate of claim 1 , which is constructed of elemental silicon, or has a covering of elemental silicon.

3. The screen plate of claim 1 , wherein the valleys of the profiled region are from 1 to 200 mm deep.

4. The screen plate of claim 1 which is made of one or more materials selected from the group consisting of plastic, ceramic, glass, diamond, amorphous carbon, silicon and metal.

5. The screen plate of claim 1 , comprising a metallic main body and a coating or lining of one or more materials selected from the group consisting of plastic, ceramic, glass, diamond, amorphous carbon and silicon.

6. The screen plate of claim 1 , comprising a coating of titanium nitride, titanium carbide, aluminum titanium nitride or DLC (diamond-like carbon).

7. The screen plate of claim 1 , which is made of hard metal or which is lined or coated with a hard metal.

8. The screen plate of claim 1 , wherein the slots have a width of up to 200 mm.

9. The screen plate of claim 1 , wherein an opening angle of the valleys of the profiled region is greater than 1° and less than 180°.

10. The method of claim 1 , wherein the screen plate has an angle of inclination to the horizontal of from 5° to 20°.

11. The screen plate of claim 1 , wherein the valleys have a depth of 20 mm.

12. The screen plate of claim 1 , wherein an included angle of the profiled region is 45°.

13. A method for the mechanical classification of polysilicon employing a screening plant, comprising feeding polysilicon onto a profiled screen plate of claim 1 , and vibrating the screen plate such that the polysilicon executes a motion in the direction of the takeoff region, wherein the fines fraction collects in the valleys of the screen plate and fall through the slots of the screen plate and is thus separated from the polysilicon feed.

14. The method of claim 13 , wherein silicon chunks classified are of chunk size 0 to 2, and the fines are polysilicon chunks which can pass through said 1 mm×1 mm screen.

15. The method of claim 13 , wherein silicon chunks classified are of chunk size 3 to 5, and the fines are polysilicon chunks which can pass through said 8 mm×8 mm screen.

16. The method of claim 13 , wherein the profiled screen plate has a surface which contacts the polysilicon chunks which comprises elemental silicon.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE DATE OF THE CHANGE OF ADDRESS FROM 03/12/2020 TO 12/03/2020 PREVIOUSLY RECORDED AT REEL: 056719 FRAME: 0881. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 1, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 057561/0451 →
CHANGE OF ADDRESS Recorded Jun 30, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 056719/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2017
From: BERGMANN, ANDREAS; BUSCHHARDT, THOMAS; EHRENSCHWENDTNER, SIMON; FRAUNHOFER, CHRISTIAN
To: SILTRONIC AG; WACKER CHEMIE AG
Reel/Frame 044426/0640 →