Packaging methods of semiconductor x-ray detectors
Disclosed herein are various methods for making apparatuses suitable for detecting X-ray. The method may comprise bonding a plurality of chips to a first substrate, wherein the first substrate comprises a plurality of electric contacts and a plurality of vias connecting the electric contacts to a surface of the first substrate, wherein each of the chips comprises an X-ray absorption layer comprising a first electrode and a second electrode, and wherein the plurality of chips are bonded to the first substrate such that the second electrode of each of the chips is electrically connected to at least one of the electrical contacts.
1. A method for making an apparatus suitable for detecting X-ray, the method comprising:
bonding a plurality of chips to a first substrate, wherein the first substrate comprises a plurality of electric contacts and a plurality of vias connecting the electric contacts to a surface of the first substrate, wherein each of the chips comprises an X-ray absorption layer comprising a first electrode and a second electrode, and wherein the plurality of chips are bonded to the first substrate such that the second electrode of each of the chips is electrically connected to at least one of the electrical contacts;
filling gaps between the chips with an electrically insulating material, wherein the first electrode of each of the chips remains exposed;
electrically connecting the first electrodes of each of the chips with an electrically conductive layer;
bonding the first substrate to a second substrate such that the vias are electrically connected to contacts pads of the second substrate.
2. The method of claim 1 , wherein the second substrate is a printed circuit board.
3. The method of claim 1 , wherein the second substrate comprises transmission lines buried therein or on a surface thereof, wherein the transmission lines electrically are connected to the contact pads and are configured to route signal on the contact pads.
4. The method of claim 1 , further comprising thinning the first substrate.
5. The method of claim 1 , wherein the electrically conductive layer is a layer of metal deposited over the chips.
6. The method of claim 1 , wherein the electrically insulating material comprises oxide, nitride, glass, polymer, epoxy or a combination thereof.
7. The method of claim 1 , wherein the first substrate comprises an electronic system configured to process or interpret signals generated by X-ray photons incident on the X-ray absorption layer.
8. A method for making an apparatus suitable for detecting X-ray, the method comprising:
bonding a plurality of chips to a first substrate, wherein the first substrate comprises a plurality of electric contacts and a plurality of vias connecting the electric contacts to a surface of the first substrate, wherein each of the chips comprises an X-ray absorption layer comprising a first electrode and a second electrode, wherein the first substrate comprises an electronic layer with an electronic system configured to process or interpret signals generated by X-ray photons incident on the X-ray absorption layer, and wherein the plurality of chips are bonded to the first substrate such that the second electrode of each of the chips is electrically connected to at least one of the electrical contacts;
dicing the chips and the first substrate into a plurality of detector chips, each detector chip comprising a portion of the X-ray absorption layer and a portion of the electronic layer;
bonding the plurality of detector chips to an interposer substrate such that the vias are electrically connected to contacts pads of the interposer substrate;
attaching the interposer substrate to a printed circuit board.
9. The method of claim 8 , wherein the interposer substrate comprises transmission lines buried therein or on a surface thereof, wherein the transmission lines electrically are connected to the contact pads and are configured to route signal on the contact pads.