IP Library Granted Patent US 10,782,340
Granted Patent B2
US 10,782,340 · App. 15/737,966 · Granted Sep 22, 2020

Dynamic response analysis prober device

Inventors: Masaaki Komori (Tokyo, JP); Katsuo Oki (Tokyo, JP); Yasuhiko Nara (Tokyo, JP); Takayuki Mizuno (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
G01R31/2889G01R1/073G01R31/2603G01R31/2879G02B21/00H01J37/28G01R31/2822G01R31/2841H01J2237/2008H01J2237/24592
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Quick Facts
Patent No.
US 10,782,340
App. No.
15/737,966
Granted
Sep 22, 2020
Kind
B2
Abstract

The present invention relates to a prober device that shapes an input waveform of a dynamic electric signal to be input to one of probes, and observes an output waveform of the dynamic electric signal output through a sample, or preferably shapes the input waveform such that the output waveform of the dynamic electric signal output through the sample becomes approximately a pulse shape, when a response analysis of a dynamic signal is performed with respect to a fine-Structured device. With this, the response analysis of a high-speed dynamic signal equal to or greater than a megahertz level can be performed with respect to the fine-Structured device such as a minute transistor configuring an LSI.

Claims (24)

1. A prober device comprising:

a sample stage that holds a sample;

a plurality of probes that come into contact with predetermined positions of the sample;

a sample room in which the sample stage and the plurality of probes are disposed in an inside thereof;

a charged particle beam microscope for observing the sample and the plurality of probes;

an input waveform forming mechanism that shapes an input waveform of a dynamic electric signal to be input to one of the probes; and

an output waveform observing mechanism for observing an output waveform of the dynamic electric signal output through the sample,

wherein the input waveform forming mechanism shapes the input waveform such that the output waveform becomes rectangular when the plurality of probes is contacted with the contacts of a normal transistor of the sample, and the output waveform observing mechanism obtains the dynamic response characteristic of another transistor that receives the shaped input waveform of the sample.

2. The prober device according to claim 1 ,

the input waveform forming mechanism is configured to adjust the input waveform such that the output waveform of the dynamic electric signal output through the sample becomes approximately a pulse shape.

3. The prober device according to claim 2 ,

the input waveform forming mechanism is configured to shape the input waveform with at least one of a convex portion at a front part of the input waveform and a concave portion at a rear part of the input waveform.

4. The prober device according to claim 1 , further comprising:

a database in which the input waveform of the dynamic electric signal is recorded,

the input waveform forming mechanism configured to form the input waveform recorded in the database according to a condition of the dynamic electric signal to be input.

5. The prober device according to claim 1 ,

the input waveform forming mechanism configured to automatically form the input waveform based on equivalent circuit simulation of a measurement system.

6. The prober device according to claim 1 , further comprising:

a first CCD camera disposed above a top surface of the sample to observe the sample from above; and

a second CCD camera disposed adjacent to a side surface of the sample to observe the sample from a lateral direction.

7. The prober device according to claim 1 ,

the sample room is divided into a first sample observation region for observation by a scanning electron microscope, a second sample observation region for observation by an optical microscope, and a probe exchange region.

8. The prober device according to claim 7 ,

the sample stage being movable between the first sample observation region, the second sample observation region, and the probe exchange region.

Assignments (2)
CHANGE OF NAME Recorded Apr 14, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052398/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2017
From: KOMORI, MASAAKI; OKI, KATSUO; NARA, YASUHIKO; MIZUNO, TAKAYUKI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 044448/0346 →
Priority Claims (1)
JP 2015-149172 · Jul 29, 2015 · national
Continuity (1)
Related Publication 20180299504A1 · Oct 18, 2018