Power semiconductor module
A power semiconductor module including a positive-side switching device and a positive-side diode device which are mounted on a positive-side conductive pattern, and a negative-side switching device and a negative-side diode device which are mounted on an output-side conductive pattern. When an insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device are disposed between the positive-side switching device and the negative-side switching device, and the negative-side diode device is disposed closer to the positive-side switching device than the positive-side diode device is.
1. A power semiconductor module comprising:
an insulating substrate including a first principal surface and a second principal surface;
a positive-side conductive pattern, a negative-side conductive pattern, and an output-side conductive pattern which are formed on the first principal surface of the insulating substrate;
a positive-side power-supply terminal provided on the positive-side conductive pattern and configured to receive a positive-side power-supply voltage;
a negative-side power-supply terminal provided on the negative-side conductive pattern and configured to receive a negative-side power-supply voltage;
an output terminal provided on the output-side conductive pattern and configured to be electrically connected to a load;
a positive-side switching device including:
a first principal surface having a first main electrode formed thereon; and
a second principal surface having a second main electrode and a control electrode formed thereon,
the first main electrode being attached to the positive-side conductive pattern, the second main electrode being connected to the output-side conductive pattern via an electrical connecting body;
a positive-side diode device including:
a first principal surface having a cathode electrode formed thereon; and
a second principal surface having an anode electrode formed thereon,
the cathode electrode being attached to the positive-side conductive pattern, the anode electrode being connected to the output-side conductive pattern via an electrical connecting body;
a negative-side switching device including:
a first principal surface having a first main electrode formed thereon; and
a second principal surface having a second main electrode and a control electrode formed thereon,
the first main electrode being attached to the output-side conductive pattern, the second main electrode being connected to the negative-side conductive pattern via an electrical connecting body; and
a negative-side diode device including:
a first principal surface having a cathode electrode formed thereon; and
a second principal surface having an anode electrode formed thereon,
the cathode electrode being attached to the output-side conductive pattern, the anode electrode being connected to the negative-side conductive pattern via an electrical connecting body,
when the insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device being disposed between the positive-side switching device and the negative-side switching device, the negative-side diode device being disposed closer to the positive-side switching device than the positive-side diode device is,
when the insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device being disposed on or along a first reference line, the first reference line connecting a location of the positive-side switching device and a location of the negative-side switching device.
2. The power semiconductor module according to claim 1 , wherein, when the insulating substrate is viewed in plan view, a part of the output-side conductive pattern is disposed between the positive-side diode device and the negative-side conductive pattern.
3. The power semiconductor module according to claim 1 , wherein, when the insulating substrate is viewed in plan view, a part of the positive-side conductive pattern is disposed between the negative-side diode device and the negative-side conductive pattern.
4. The power semiconductor module according to claim 2 , wherein
when the insulating substrate is viewed in plan view, the output terminal is disposed opposite to the positive-side switching device across the negative-side switching device,
when the insulating substrate is viewed in plan view, the positive-side power-supply terminal is disposed opposite to the negative-side switching device across the positive-side switching device, and
when the insulating substrate is viewed in plan view, the negative-side power-supply terminal is disposed to be adjacent to the positive-side power-supply terminal and to be remoter from the output terminal than the positive-side switching device is.
5. The power semiconductor module according to claim 3 , wherein
when the insulating substrate is viewed in plan view, the positive-side power-supply terminal and the negative-side power-supply terminal are disposed on a side opposite to the output terminal with respect to the first reference line,
when the insulating substrate is viewed in plan view, the positive-side power-supply terminal is disposed to be adjacent to the positive-side switching device and to be remoter from the first reference line than the positive-side switching device is, and
when the insulating substrate is viewed in plan view, the negative-side power-supply terminal is disposed to be adjacent to the negative-side switching device and to be remoter from the first reference line than the negative-side switching device is.
6. The power semiconductor module according to claim 2 , wherein, when the insulating substrate is viewed in plan view, the positive-side power-supply terminal and the negative-side power-supply terminal are disposed along a second reference line, the second reference line extending between the positive-side diode device and the negative-side diode device and being orthogonal to the first reference line.
7. The power semiconductor module according to claim 1 , the power semiconductor module further comprising:
a positive-side control terminal formed on the insulating substrate and connected to the control electrode of the positive-side switching device via an electrical connecting body; and
a negative-side control terminal formed on the insulating substrate and connected to the control electrode of the negative-side switching device via an electrical connecting body, wherein
when the insulating substrate is viewed in plan view, the electrical connecting body connecting the control electrode of the positive-side switching device with the positive-side control terminal does not cross over the negative-side conductive pattern and the output-side conductive pattern, and
when the insulating substrate is viewed in plan view, the electrical connecting body connecting the control electrode of the negative-side switching device with the negative-side control terminal does not cross over the positive-side conductive pattern and the output-side conductive pattern.
8. The power semiconductor module according to claim 7 , wherein
when the insulating substrate is viewed in plan view,
the positive-side control terminal and the negative-side control terminal are disposed on the same side with respect to the first reference line,
the positive-side control terminal is disposed to be adjacent to the positive-side conductive pattern and to be remoter from the first reference line than the positive-side conductive pattern is, and
the negative-side control terminal is disposed to be adjacent to the output-side conductive pattern and to be remoter from the first reference line than the output-side conductive pattern is.