IP Library › Granted Patent US 11,004,602
Granted Patent B2
US 11,004,602 · App. 15/739,950 · Granted May 11, 2021

Manufacturing method of flat coil and electronic apparatus

Inventor: Quanbo Zou (Shandong, CN)
Assignee: Goertek Inc.
H01F41/074H01F5/003H01F27/2847H01F27/2871H01F41/04H01F41/045H01F41/047H02J50/10H01F2027/2857Y10T29/49073Y10T29/49108
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Quick Facts
Patent No.
US 11,004,602
App. No.
15/739,950
Granted
May 11, 2021
Kind
B2
Abstract

A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.

Claims (51)

1. A method for manufacturing a flat coil, the method comprising:

rolling a metal foil lamination onto a carrier roller to form a foil rod;

sliding the foil rod from the carrier roller;

slicing the foil rod into thin disks; and

processing the thin disks to form at least one flat coil,

wherein:

the metal foil lamination includes at least one layer of metal foil, and

a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.

2. The method according to claim 1 , wherein the carrier roller has a starting slit, and one end of the metal foil lamination is inserted and fixed in the starting slit.

3. The method according to claim 1 , wherein the metal foil lamination includes at least two layers of metal foils.

4. The method according to claim 1 , wherein processing the thin disks further comprises:

grinding the thin disks to a preset thickness;

coating the thin disks with a passivation layer; and

forming terminals of the thin disks.

5. The method according to claim 1 , wherein the metal foil is a Cu foil.

6. The method according to claim 1 , wherein the foil rod is sliced by using at least one of blade dicing, wire cutting, and wire electrical discharging machining.

7. The method according to claim 1 , wherein the metal foil contains an insulation layer with adhesive.

8. A method for manufacturing a flat coil, the method comprising:

rolling a metal foil lamination onto a carrier roller to form a foil rod;

sliding the foil rod from the carrier roller;

slicing the foil rod into thin disks; and

processing the thin disks to form at least one flat coil,

wherein:

the metal foil lamination includes at least one layer of metal foil, and

processing the thin disks further comprises:

grinding the thin disks to a preset thickness;

coating the thin disks with a passivation layer; and

forming terminals of the thin disks.

9. The method according to claim 8 , wherein the carrier roller has a starting slit, and one end of the metal foil lamination is inserted and fixed in the starting slit.

10. The method according to claim 8 , wherein the metal foil lamination includes at least two layers of metal foils.

11. The method according to claim 8 , wherein the metal foil is a Cu foil.

12. The method according to claim 8 , wherein either:

the foil rod is sliced by using at least one of blade dicing, wire cutting, and wire electrical discharging machining; or

the metal foil contains an insulation layer with adhesive.

13. A method for manufacturing a flat coil, the method comprising:

rolling a metal foil lamination onto a carrier roller to form a foil rod;

sliding the foil rod from the carrier roller;

slicing the foil rod into thin disks; and

processing the thin disks to form at least one flat coil,

wherein:

the metal foil lamination includes at least one layer of metal foil, and

the metal foil contains an insulation layer with adhesive.

14. The method according to claim 13 , wherein the carrier roller has a starting slit, and one end of the metal foil lamination is inserted and fixed in the starting slit.

15. The method according to claim 13 , wherein the metal foil lamination includes at least two layers of metal foils.

16. The method according to claim 13 , wherein processing the thin disks further comprises:

grinding the thin disks to a preset thickness;

coating the thin disks with a passivation layer; and

forming terminals of the thin disks.

17. The method according to claim 13 , wherein either:

the metal foil is a Cu foil; or

the foil rod is sliced by using at least one of blade dicing, wire cutting, and wire electrical discharging machining.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2020
From: GOERTEK, INC.
To: WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
Reel/Frame 052846/0443 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2017
From: ZOU, QUANBO
To: GOERTEK INC.
Reel/Frame 044486/0439 →
Continuity (1)
Related Publication 20190115151A1 · Apr 18, 2019