Wiring structure of glass substrate, glass substrate and display device
View Patent ↗The disclosure provides a wiring structure of a glass substrate used between a demultiplexer MUX and an integrated circuit IC. The siring structure includes a plurality of connecting lines, two ends of each connecting line are connected to the MUX and the IC, and a predetermined spacing is reserved between any two adjacent connecting lines. Wherein one or more conductive convex teeth are provided on at least one connecting line, and a predetermined distance is reserved between each convex tooth on any one of the connecting lines and an adjacent connecting line thereof or each convex tooth on the adjacent connecting line. The disclosure also provides a glass substrate and a display device. Performing the disclosure may reduce the resistance of the wiring in the present limited wiring space and improve the charging effect of the glass substrate.
1. A wiring structure of a glass substrate, used between a demultiplexer MUX and an integrated circuit IC, comprising a plurality of connecting lines, two ends of each connecting line being connected to the MUX and the IC, and a predetermined spacing being reserved between any two adjacent connecting lines, wherein,
one or more conductive convex teeth are provided on at least one connecting line, and a predetermined distance is reserved between each convex tooth on any one of the connecting lines and an adjacent connecting line thereof or each convex tooth on the adjacent connecting line.
2. The wiring structure of the glass substrate according to claim 1 , wherein the convex teeth on the opposite sides between any two adjacent connecting lines are arranged in a staggered interlocking manner.
3. The wiring structure of the glass substrate according to claim 2 , wherein a length of any one of the connecting lines is a shortest distance between the MUX and the IC.
4. The wiring structure of the glass substrate according to claim 3 , wherein any one of the convex teeth is made of the same material as that of a connecting line connected thereof.
5. The wiring structure of the glass substrate according to claim 4 , wherein any two adjacent connecting lines are made of different materials.
6. The wiring structure of the glass substrate according to claim 5 , wherein the connecting lines with odd-numbered arrangement distribution are made of the same materials, and the connecting lines with even-numbered bits arrangement distribution are made of the same material.
7. The wiring structure of the glass substrate according to claim 6 , wherein the making materials of the connecting lines comprise metal aluminum and metal molybdenum.
8. A glass substrate, comprising: a wiring structure of a glass substrate, the wiring structure of the glass substrate used between a demultiplexer MUX and an integrated circuit IC, comprising a plurality of connecting lines, two ends of each connecting line being connected to the MUX and the IC, and a predetermined spacing being reserved between any two adjacent connecting lines, wherein,
one or more conductive convex teeth are provided on at least one connecting line, and a predetermined distance is reserved between each convex tooth on any one of the connecting lines and an adjacent connecting line thereof or each convex tooth on the adjacent connecting line.
9. The glass substrate according to claim 8 , wherein the convex teeth on the opposite sides between any two adjacent connecting lines are arranged in a staggered interlocking manner.
10. The glass substrate according to claim 8 , wherein a length of any one of the connecting lines is a shortest distance between the MUX and the IC.
11. The glass substrate according to claim 10 , wherein any one of the convex teeth is made of the same material as that of a connecting line connected thereof.
12. The glass substrate according to claim 11 , wherein any two adjacent connecting lines are made of different materials.
13. The glass substrate according to claim 12 , wherein the connecting lines with odd-numbered arrangement distribution are made of the same material, and the connecting lines with even-numbered arrangement distribution are made of the same material.
14. The glass substrate according to claim 13 , wherein making materials of the connecting lines comprise metal aluminum and metal molybdenum.
15. A display device, comprising: a glass substrate, the glass substrate comprising a wiring structure of a glass substrate, the wiring structure of the glass substrate being used between a demultiplexer MUX and an integrated circuit IC, comprising a plurality of connecting lines, both ends of each connecting line being connected to the MUX and the IC, and a predetermined spacing being reserved between any adjacent connecting lines, wherein,
one or more conductive convex teeth are provided on at least one connecting line, and a predetermined distance is reserved between each convex tooth on any one of the connecting lines and an adjacent connecting line thereof or each convex tooth on the adjacent connecting line.
16. The display device according to claim 15 , wherein the convex teeth on the opposite sides between any two an adjacent connecting lines are arranged in a staggered interlocking manner.
17. The display device according to claim 16 , wherein a length of any one of the connecting lines is a shortest distance between the MUX and the IC.
18. The display device according to claim 17 , wherein any one of the convex teeth is made of the same material as that of a connecting line connected thereof.
19. The display device according to claim 18 , wherein any two adjacent connecting lines are made of different materials.
20. The display device according to claim 19 , wherein the connecting lines with odd-numbered arrangement distribution are made of the same material, and the connecting lines with even-numbered arrangement distribution are made of the same material.