IP Library Granted Patent US 10,247,485
Granted Patent B2
US 10,247,485 · App. 15/745,873 · Granted Apr 2, 2019

Pipe member, heat pipe, and cooling device

Inventor: Takahiro Koda (Tokyo, JP)
Assignee: Marusan Electronics Co., Ltd.
F28D15/0241F28D1/047F28D15/02F28D15/0266F28D15/043F28F1/40
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Quick Facts
Patent No.
US 10,247,485
App. No.
15/745,873
Granted
Apr 2, 2019
Kind
B2
Abstract

A pipe member is provided that is capable of configuring a heat pipe that can be installed with a high flexibility in accordance with the state of the installation place. A heat pipe configured by using such a pipe member, and a cooling device are also provided. The pipe member includes: an arbitrarily bendable pipe main body whose both ends are closed when used for the heat pipe; a partition wall extended in an axial direction of the pipe main body to partition the inside of the pipe main body into four passages each being utilized as a flow path of the working fluid; and connection paths which allow neighboring passages to communicate with each other out of the four passages.

Claims (27)

1. A heat pipe member comprising:

a main pipe having first and second ends opposite to each other, each of the first and second ends being closed so that the main pipe has a closed inner space;

a partition wall that divides the inner space of the main pipe into four or more passages, the four or more passages being arranged radially around a center axis of the main pipe so that each of the four or more passages extends along the main pipe; and

first and second connection paths that are formed in the vicinity of the first and second ends of the main pipe, respectively, the first connection path being fluidly connected between two adjacent passages of the four or more passages, the second connection path being fluidly connected between the other two adjacent passages of the four or more passages,

wherein the four or more passages, the first connection path, and the second connection path configure a single closed loop through which a working fluid flows.

2. The heat pipe member according to claim 1 ,

wherein the main pipe is in a cylindrical shape, and

the main pipe is bendable.

3. The heat pipe member according to claim 2 ,

wherein the partition wall is configured with a plurality of sub-walls, and each of the plurality of sub-walls radially extends from the center axis of the main pipe.

4. The heat pipe member according to claim 1 ,

wherein the partition wall is configured with a plurality of sub-walls, and each of the plurality of sub-walls radially extends from the center axis of the main pipe.

5. A cooling device comprising:

a heat receiver that is configured to receive heat from a heat generator component;

a heat pipe member that is configured to transfer the heat that is received by the heat receiver, the heat pipe including;

a main pipe having first and second ends opposite to each other, each of the first and second ends being closed so that the main pipe has a closed inner space;

a partition wall that divides the inner space of the main pipe into four or more passages, the four or more passages being arranged radially around a center axis of the main pipe so that each of the four or more passages extends along the main pipe; and

first and second connection paths that are formed in the vicinity of the first and second ends of the main pipe, respectively, the first connection path being fluidly connected between two adjacent passages of the four or more passages, the second connection path being fluidly connected between the other two adjacent passages of the four or more passages; and

a heat-radiator that is configured to radiate the heat that is transferred by the heat pipe member,

wherein the four or more passages, the first connection path, and the second connection path configure a single closed loop through which a working fluid flows.

6. The cooling device according to claim 5 ,

wherein the main pipe is in a cylindrical shape, and

the main pipe is bendable.

7. The cooling device according to claim 6 ,

wherein the partition wall is configured with a plurality of sub-walls, and each of the plurality of sub-walls radially extends from the center axis of the main pipe.

8. The cooling device according to claim 5 ,

wherein the partition wall is configured with a plurality of sub-walls, and each of the plurality of sub-walls radially extends from the center axis of the main pipe.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2018
From: KODA, TAKAHIRO
To: MARUSAN ELECTRONICS CO., LTD.
Reel/Frame 044658/0978 →
Priority Claims (1)
WO PCT/JP2015/079786 · Oct 22, 2015 · international
Continuity (1)
Related Publication 20180216895A1 · Aug 2, 2018