Method for producing a component from ceramic materials
The invention relates to a method for producing a component from ceramic materials in which a plurality of layers are applied to a base body by means of screen printing or template printing, said layers being formed from a ceramic material, in each case in a defined geometry above one another in the form of a paste or suspension in which powdery ceramic material and at least one binder are included. At least one region is formed here within at least one layer having a defined thickness and geometry composed of a further material that can be removed in a thermal treatment and that is likewise applied in the form of a paste or suspension by means of screen printing or template printing. Electrically functional structures composed of an electrically conductive or semiconductive material are applied to and/or formed on and/or in at least of the ceramic layers prior to the application of a further ceramic layer. The layer structure is then sintered in a thermal heat treatment, with the further material being removed and at least one hollow space being formed with defined dimensions of width, length, and height.
1. Method for producing a component from ceramic materials formed as a pressure sensor, a force sensor, an acceleration sensor, a micropump, a membrane valve, a microreactor, a micromixer, or a piezoelectric actuator sensor element, in which ceramic layers including a last ceramic layer are applied to a base body by screen printing or template printing, each of said ceramic layers being formed from a ceramic material in a defined geometry above one another in the form of a paste or suspension each having a thickness in the range of 10 μm to 50 μm in which powdery ceramic material and at least one binder are included, at least one region is formed having a defined thickness and geometry from a further material that can be removed in a thermal treatment and is applied in the form of a paste or suspension by screen printing or template printing, and on the at least one region is applied a further ceramic layer formed from a ceramic material in a defined geometry in the form of a paste or suspension having a thickness in the range of 10 μm to 20 μm in which powdery ceramic material and at least one binder are included; and
electrically functional structures composed of an electrically conductive or semiconductive material are applied to and formed on at least one of the ceramic layers prior to the application of the further ceramic layer; and
the layer structure is sintered in a thermal heat treatment, sintering the ceramic material in the at least one ceramic layer and the further ceramic layer, with the further material being removed and, between the at least one sintered ceramic layer and the sintered further ceramic layer, at least one hollow space surrounded by the sintered ceramic material being formed with defined dimensions of width, length, and height, wherein the at least one hollow space with the sintered further ceramic layer having a pre-sintered thickness in the range of 10 μm to 20 μm forms a membrane or a mechanical spring.
2. A method in accordance with claim 1 , characterized in that the ceramic layers are formed from LTCC, HTCC, Al 2 O 3 , ZrO 2 , alumina toughened zirconia (ATZ), zirconia toughened alumina (ZTA), AlN and/or Si 3 N 4 .
3. A method in accordance with claim 1 , characterized in that the ceramic layers of the component are formed in a defined order, in a defined number, and in a defined thickness, in each case from different ceramic materials, with the different ceramic materials having different thermal coefficients of expansion and/or different degrees of shrinkage on sintering and being sinterable with one another.
4. A method in accordance with claim 1 , characterized in that epoxy resin, polyvinyl alcohol (PVA), polyvinyl butyral (PVB), polyvinylidene fluoride (PVDF), alginates, acrylates, celluloses, or UV-hardening systems are used.
5. A method in accordance with claim 1 , characterized in that the thermal treatment is carried out in a temperature range from 500° C. to 1800° C.
6. A method in accordance with claim 1 , characterized in that regions into which a further material is introduced are formed within at least one layer having a defined thickness and geometry by stamping and/or laser ablation.
7. A method in accordance with claim 1 , characterized in that electrically functional structures are configured in the form of electrical electrodes or conductive tracks, electrical resistors and/or coil and/or capacitor arrangements.
8. A method in accordance with claim 1 , characterized in that passages and chambers are formed with hollow spaces formed in the interior of the component.
9. A method in accordance with claim 1 , characterized in that a membrane is formed having reinforcements and/or beads arranged in a locally defined manner and dimensioned in a defined manner.
10. A method in accordance with claim 1 , characterized in that the ceramic layers are formed having thickness in the range of 10 μm to 20 μm.