MEMS MICROPHONE
A MEMS microphone, which comprises a substrate, a first vibrating diaphragm and a second vibrating diaphragm is provided. A sealed cavity is formed between the first vibrating diaphragm and the second vibrating diaphragm. A back electrode unit is located in the sealed cavity, forms a capacitor structure with the first vibrating diaphragm and with the second vibrating diaphragm respectively, and is provided with a plurality of through holes that penetrate through two sides thereof. The sealed cavity is filled with a gas whose viscosity coefficient is smaller than that of air. According to the MEMS microphone disclosed by the present invention, by filling the sealed cavity with a gas whose viscosity coefficient is smaller than that of air, the acoustic resistance when the two vibrating diaphragms move relative to the back electrode can be reduced greatly, thereby reducing the noise of the microphone. Meanwhile, by the use of a gas with a low viscosity coefficient for filling, the pressure in the sealed cavity is consistent with the pressure of an external environment, thereby avoiding the problem of vibrating diaphragm deflection caused by pressure difference and ensuring the performances of the microphone.
1 - 15 . (canceled)
16 . An MEMS microphone, comprising:
a substrate;
a first vibrating diaphragm and a second vibrating diaphragm between which a sealed cavity is formed; and
a back electrode unit, which is located in the sealed cavity, forms a capacitor structure with the first vibrating diaphragm and with the second vibrating diaphragm respectively, and is provided with a plurality of through holes that penetrate through two sides of the back electrode unit,
wherein the sealed cavity is filled with a gas whose viscosity coefficient is smaller than that of air.
17 . The MEMS microphone according to claim 16 , wherein the gas is selected from at least one of isobutene, propane, propylene, H 2 , ethane, ammonia, acetylene, ethyl chloride, ethylene, CH 3 Cl, methane, SO 2 , H 2 S, chlorine, CO 2 , N 2 O, or N 2 .
18 . The MEMS microphone according to claim 16 , wherein the pressure of the sealed cavity is consistent with that of an external environment.
19 . The MEMS microphone according to any of claims 16 , wherein the pressure of the sealed cavity is one standard atmospheric pressure.
20 . The MEMS microphone according to claim 16 , wherein the pressure difference between the sealed cavity and an external environment is less than 0.5 atm.
21 . The MEMS microphone according to claim 20 , wherein the pressure difference between the sealed cavity and the external environment is less than 0.1 atm.
22 . The MEMS microphone according to claim 16 , wherein a gap between the back electrode unit and each of the first vibrating diaphragm and the second vibrating diaphragm is 0.5-3 μm.
23 . The MEMS microphone according to claim 16 , wherein:
one or more support columns are also arranged between the first vibrating diaphragm and the second vibrating diaphragm and penetrate through the through holes of the back electrode unit, and
two ends of each of the support columns are connected to the first vibrating diaphragm and the second vibrating diaphragm respectively.
24 . The MEMS microphone according to claim 23 , wherein the material of the support columns is the same as that of the first vibrating diaphragm and/or the second vibrating diaphragm.
25 . The MEMS microphone according to claim 23 , wherein the support columns are made of an insulating material.
26 . The MEMS microphone according to claim 16 , wherein the back electrode unit is a back electrode plate which forms the capacitor structure with the first vibrating diaphragm and with the second vibrating diaphragm respectively.
27 . The MEMS microphone according to claim 16 , wherein:
the back electrode unit comprises a first back electrode plate for forming one capacitor structure with the first vibrating diaphragm and a second back electrode plate for forming another capacitor structure with the second vibrating diaphragm; and
an insulating layer is arranged between the first back electrode plate and the second back electrode plate.
28 . The MEMS microphone according to claim 16 , wherein the sealed cavity is sealed at room temperature and normal pressure.
29 . The MEMS microphone according to claim 16 , further comprising a pressure relief hole which penetrates through the first vibrating diaphragm and the second vibrating diaphragm, wherein the wall of the pressure relief hole defines the sealed cavity together with the first vibrating diaphragm and the second vibrating diaphragm.
30 . The MEMS microphone according to claim 29 , wherein either:
one pressure relief hole, which goes through the middle of the first vibrating diaphragm and the middle of the second vibrating diaphragm, is provided; or
a plurality of pressure relief holes are provided.