IP Library Granted Patent US 10,256,131
Granted Patent B2
US 10,256,131 · App. 15/752,863 · Granted Apr 9, 2019

Electrostatic chuck device

Inventors: Mamoru Kosakai (Tokyo, JP); Shinichi Maeta (Tokyo, JP); Keisuke Maeda (Tokyo, JP)
Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
H01L21/6833B23Q3/15H01L21/3065H01L21/67109H01L21/67248H01L21/683H01L21/6835H02N13/00
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Quick Facts
Patent No.
US 10,256,131
App. No.
15/752,863
Granted
Apr 9, 2019
Kind
B2
Abstract

An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

Claims (43)

1. An electrostatic chuck device comprising:

an electrostatic chuck member; and

a temperature controlling base member,

wherein the electrostatic chuck member includes

a ceramic plate whose one surface is a mounting surface to mount a plate-shaped sample, and

an electrode for electrostatic attraction which is provided on a surface side of the ceramic plate which is opposite to the mounting surface side,

wherein the temperature controlling base member is configured to cool the electrostatic chuck member, and is disposed on a surface side of the electrode for electrostatic attraction which is opposite to the ceramic plate side,

wherein the ceramic plate includes a dike portion extending to the temperature controlling base member side and surrounding a periphery of the electrode for electrostatic attraction,

wherein the temperature controlling base member includes a groove portion that is configured to accommodate an end part of the dike portion, and

wherein a space between the groove portion and the dike portion is filled with a filling part which is formed of a resin material.

2. The electrostatic chuck device according to claim 1 ,

wherein the dike portion has a closed-circular shape, and

the groove portion is provided with a closed-circular groove which corresponds to the dike portion.

3. The electrostatic chuck device according to claim 1 ,

wherein the dike portion has a step provided at the dike portion, in which a width of the dike portion decreases in a stepwise manner toward the end part of the dike portion, wherein the end part is positioned on the temperature controlling base member side, and

wherein the groove portion has a step provided at the groove portion, in which a width decreases toward a bottom side corresponding to the step provided at the dike portion.

4. The electrostatic chuck device according to claim 1 ,

wherein the end part of the dike portion, in which the end part is positioned at the temperature controlling base member side, is a chamfered end part.

5. The electrostatic chuck device according to claim 1 ,

wherein an exposed portion of the filling part which is exposed to the outside is covered with an O-ring.

6. The electrostatic chuck device according to claim 1 , further comprising:

an adhesive layer which adheres the electrostatic chuck member and the temperature controlling base member to each other,

wherein the adhesive layer includes

the filling part, and

an interposing part, which is positioned between the electrode for electrostatic attraction and the temperature controlling base member.

7. The electrostatic chuck device according to claim 6 ,

wherein the adhesive layer is divided into

a portion formed of a first resin material, and

a portion formed of a second resin material which has higher plasma resistance than that of the first resin material, and

wherein an exposed portion of the adhesive layer, which is exposed to the outside, is formed of the second resin material.

8. The electrostatic chuck device according to claim 1 , further comprising:

a first organic insulating layer which is provided between the ceramic plate and the electrode for electrostatic attraction.

9. The electrostatic chuck device according to claim 1 , further comprising:

a second organic insulating layer which is provided between the temperature controlling base member and the electrode for electrostatic attraction.

10. An electrostatic chuck device comprising:

a ceramic plate; and

a temperature controlling base member,

wherein the ceramic plate has one surface which is a mounting surface on which a plate-shaped sample is mounted,

wherein an electrode for electrostatic attraction is provided on the ceramic plate,

wherein the temperature controlling base member is a base member that is configured to cool the ceramic plate from a side opposite to the mounting surface of the ceramic plate,

wherein the ceramic plate includes a dike portion extending to the temperature controlling base member side and surrounding a periphery of the electrode for electrostatic attraction,

wherein the temperature controlling base member includes a groove portion that is configured to accommodate an end part of the dike portion, and

wherein a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2018
From: KOSAKAI, MAMORU; MAETA, SHINICHI; MAEDA, KEISUKE
To: SUMITOMO OSAKA CEMENT CO., LTD.
Reel/Frame 044933/0034 →
Priority Claims (1)
JP 2015-168230 · Aug 27, 2015 · national
Continuity (1)
Related Publication 20180254211A1 · Sep 6, 2018
Cited By (1)
US 12,315,745