Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.
1. A substrate for a printed circuit board, comprising a base film; and a metal layer disposed on at least one of surfaces of the base film,
wherein an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less,
wherein an amount of silicon present per unit area, the amount being determined on the basis of a peak area of a Si2p spectrum in XPS analysis of the exposed surface of the base film, is 1 atomic % or more and 10 atomic % or less,
wherein a ratio of the amount of silicon present per unit area to the amount of nitrogen present per unit area of the exposed surface of the base film is 4 or less,
wherein a surface of the metal layer, the surface being disposed on the base film side, has a ten-point average roughness Rz of 0.01 μm or more and 5.0 μm or less,
wherein the base film contains a fluororesin as a main component, and
wherein the fluororesin is tetrafluoroethylene-hexafluoropropylene copolymers (FEP), polytetrafluoroethylene-perfluoroalkyl vinyl ether copolymers (PFA), or polytetrafluoroethylene (PTFE).
2. The substrate for a printed circuit board according to claim 1 , wherein a coupling agent containing nitrogen or a group derived from the coupling agent is present in the vicinity of an interface between the base film and the metal layer.
3. The substrate for a printed circuit board according to claim 2 , wherein the coupling agent is a silane coupling agent.
4. The substrate for a printed circuit board according to claim 1 ,
wherein the amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of the exposed surface of the base film is 3 atomic % or more and 10 atomic % or less.
5. The substrate for a printed circuit board according to claim 1 ,
wherein the ratio of the amount of silicon present per unit area to the amount of nitrogen present per unit area of the exposed surface of the base film is 0.1 or more and 1.5 or less.
6. The substrate for a printed circuit board according to claim 1 ,
wherein a silane coupling agent containing nitrogen or a group derived from the silane coupling agent is present in the vicinity of an interface between the base film and the metal layer,
wherein the nitrogen forms a C—N bond with carbon in a resin constituting the base film.
7. A printed circuit board comprising a base film; and a metal pattern disposed on at least one of surfaces of the base film,
wherein an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal pattern by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less,
wherein an amount of silicon present per unit area, the amount being determined on the basis of a peak area of a Si2p spectrum in XPS analysis of the exposed surface of the base film, is 1 atomic % or more and 10 atomic % or less,
wherein a ratio of the amount of silicon present per unit area to the amount of nitrogen present per unit area of the exposed surface of the base film is 4 or less,
wherein a surface of the metal layer, the surface being disposed on the base film side, has a ten-point average roughness Rz of 0.01 μm or more and 5.0 μm or less,
wherein the base film contains a fluororesin as a main component, and
wherein the fluororesin is tetrafluoroethylene-hexafluoropropylene copolymers (FEP), polytetrafluoroethylene-perfluoroalkyl vinyl ether copolymers (PFA), or polytetrafluoroethylene (PTFE).