IP Library Granted Patent US 11,192,354
Granted Patent B2
US 11,192,354 · App. 15/757,113 · Granted Dec 7, 2021

3D printing method utilizing heat-curable silicone composition

Inventors: Michael W. Backer (Mainz, DE); Zachary Milroy (Midland, MI); Sara Schaubroeck (Midland, MI); Hans Peter Wolf (Liederbach, DE); Bizhong Zhu (Midland, MI)
Assignee: Dow Silicones Corporation
B33Y80/00B29C64/112B29C64/118B29C64/153B29C64/209B29C64/295B33Y10/00B33Y70/00C08G77/12C08G77/16C08L83/04B29K2083/00
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Quick Facts
Patent No.
US 11,192,354
App. No.
15/757,113
Granted
Dec 7, 2021
Kind
B2
Abstract

A method of forming a three-dimensional (3D) article comprises the steps of I) printing a first heat-curable silicone composition with a 3D printer to form a layer, II) heating the layer to form an at least partially cured layer, III) printing a second heat-curable silicone composition on the at least partially cured layer with the 3D printer to form a subsequent layer, and IV) heating the subsequent layer to form an at least partially cured subsequent layer. Optionally, steps III) and IV) can be repeated with independently selected heat-curable silicone composition(s) for any additional layer(s) to form the 3D article. The first and second heat-curable silicone compositions may be the same as or different from one another.

Claims (20)

1. A method of forming a three-dimensional (3D) article, said method comprising:

I) printing a first heat-curable silicone composition with a 3D printer to form a layer, wherein the first heat-curable silicone composition is not heated during printing in I);

II) heating the layer to form an at least partially cured layer;

III) printing a second heat-curable silicone composition on the at least partially cured layer with the 3D printer to form a subsequent layer, wherein the second heat-curable silicone composition is not heated during printing in III);

IV) heating the subsequent layer to form an at least partially cured subsequent layer; and,

V) optionally, repeating steps III) and IV) with independently selected heat-curable silicone composition(s) for any additional layer(s) to form the 3D article;

wherein the first and second heat-curable silicone compositions are the same as or different from one another, wherein the first and second heat-curable silicone compositions are not cured via irradiation; and

wherein the first and second heat-curable silicone compositions are independently selected from condensation-curable silicone compositions, hydrosilylation-curable silicone compositions, free radical-curable silicone compositions, and dual-cure silicone compositions.

2. The method according to claim 1 , wherein steps II) and IV) are independently selected from (i) conductive heating via a substrate on which the layer is printed; (ii) heating the particular heat-curable silicone composition via the 3D printer or a component thereof; (iii) infrared heating; (iv) electromagnetic heating; (v) a heating bath with a heat transfer fluid; (vi) heating from an exothermic reaction of the particular heat-curable silicone composition; (vii) magnetic heating; or (viii) any combination of (i) to (vii).

3. The method according to claim 1 , wherein the first and second heat-curable silicone compositions are the same.

4. The method according to claim 1 , wherein the first and/or second heat-curable silicone composition(s) comprise(s) a hydrosilylation-curable silicone composition comprising (A) an organopolysiloxane having an average of at least two silicon-bonded alkenyl groups or silicon-bonded hydrogen atoms per molecule; (B) an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms or silicon-bonded alkenyl groups per molecule capable of reacting with the silicon-bonded alkenyl groups or silicon-bonded hydrogen atoms in the organopolysiloxane (A); and (C) a hydrosilylation catalyst.

5. The method according to claim 1 , wherein the first and/or second heat-curable silicone composition(s) comprise(s) a condensation-curable silicone composition comprising (A′) an organopolysiloxane having an average of at least two silicon-bonded hydroxyl or hydrolysable groups per molecule; optionally (B′) an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms, hydroxyl groups, or hydrolysable groups per molecule; and (C′) a condensation catalyst; and optionally, wherein the condensation-curable silicone composition is a multipart composition, wherein component (A′) is in a first part, component (B′) is in a second part separate from the first part, and component (C′) is in the second part and/or in a third part separate from the first and second parts.

6. The method according to claim 1 , wherein the first and/or second heat-curable silicone composition(s) comprise(s) a free radical-curable silicone composition comprising (A″) an organopolysiloxane having an average of at least two silicon-bonded unsaturated groups and (C″) an organic peroxide.

7. The method according to claim 1 , wherein the first and second heat-curable silicone compositions are different from one another.

8. The method according to claim 1 , wherein the first and/or second heat-curable silicone composition(s) is(are) a multi-part heat-curable silicone composition comprising at least a first part and a second part separate from the first part; and optionally, wherein the separate parts of the multi-part heat-curable silicone composition are mixed in a dual dispense printing nozzle prior to printing.

9. The method according to claim 1 , wherein the 3D printer is selected from a fused filament fabrication printer, a selective laser sintering printer, a selective laser melting printer, a stereolithography printer, a powder bed (binder jet) printer, a material jet printer, a direct metal laser sintering printer, an electron beam melting printer, a laminated object manufacturing deposition printer, a directed energy deposition printer, a laser powder forming printer, a polyjet printer, an ink-jetting printer, a material jetting printer, and a syringe extrusion printer.

10. The method according to claim 1 , wherein the at least partially cured layer formed in step II) retains its shape upon exposure to ambient conditions.

11. The method according to claim 1 , wherein heating via steps II) and IV) is carried out at a temperature independently selected from above ambient temperature to 300° C.

12. The method according to claim 1 , wherein the first and/or second heat-curable composition(s) is(are) shear thinning.

13. A 3D article formed in accordance with the method of claim 1 .

Assignments (4)
CHANGE OF NAME Recorded Jun 25, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 046191/0869 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2018
From: MILROY, ZACHARY; SCHAUBROECK, SARA; ZHU, BIZHONG
To: DOW CORNING CORPORATION
Reel/Frame 045091/0046 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2018
From: BACKER, MICHAEL W.; WOLF, HANS PETER
To: DOW CORNING GMBH
Reel/Frame 045091/0052 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2018
From: DOW CORNING GMBH
To: DOW CORNING CORPORATION
Reel/Frame 045091/0068 →
Continuity (2)
Provisional Application 62213945 · Sep 3, 2015
Related Publication 20180186076A1 · Jul 5, 2018
Cited By (1)
US 12,490,412