Manufacturing method of printed board
Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.
1. A manufacturing method of a printed board that has a permanently-bent part, the manufacturing method comprising:
a preparing step for preparing a plurality of insulating base members, each being a film, the insulating base members being formed of, at least, a resin material, and the preparing step including forming conductor patterns on surfaces of the insulating base members;
a laminating step for laminating the insulating base members to form a laminate; and
a heat-and-pressure applying step for applying heat and pressure to the laminate to integrate the insulating base members into one piece and then releasing the pressure applied to the laminate and cooling the laminate,
wherein
all of the insulating base members prepared in the preparing step are formed of the same resin material,
in the laminating step, the laminate is formed so that: in a predetermined region of the laminate which is to constitute the permanently-bent part, one or more of the insulating base members are arranged on each of one side and the other side of all of the conductor patterns in the predetermined region in a lamination direction of the insulating base members, and a total thickness of the one or more insulating base members arranged on the one side of all of the conductor patterns in the predetermined region is larger than a total thickness of the one or more insulating base members arranged on the other side of all of the conductor patterns in the predetermined region,
in the heat-and-pressure applying step, the predetermined region is bent, with the one side of all of the conductor patterns in the predetermined region being an inner side of the bending, during the cooling by a contraction force generated in the one or more insulating base members on the one side of all of the conductor patterns in the predetermined region that is larger than a contraction force generated in the one or more insulating base members on the other side of all of the conductor patterns in the predetermined region,
the predetermined region constitutes the entirety of the permanently-bent part of the printed board and the total thickness of the one or more insulating base members arranged on the one side of all of the conductor patterns throughout the entirety of the predetermined region is larger than the total thickness of the one or more insulating base members arranged on the other side of all of the conductor patterns throughout the entirety of the predetermined region, and
each of the one or more insulating base members has a constant thickness.
2. The manufacturing method of the printed board as set forth in claim 1 , wherein in the laminating step, the laminate is formed so that the number of the one or more insulating base members arranged on the one side of all of the conductor patterns in the predetermined region is greater than the number of the one or more insulating base members arranged on the other side of all of the conductor patterns in the predetermined region.
3. The manufacturing method of the printed board as set forth in claim 2 , wherein each of the insulating base members prepared in the preparing step have the same individual thickness.
4. The manufacturing method of the printed board as set forth in claim 1 , wherein in the laminating step, the laminate is formed so that the number of the insulating base members laminated in another region, which is at a different position from the predetermined region, is greater than the number of the insulating base members laminated in the predetermined region.
5. The manufacturing method of the printed board as set forth in claim 4 , wherein the insulating base members prepared in the preparing step each have a predetermined thickness, and
in the laminating step, the laminate is formed so that:
the number of the one or more insulating base members arranged on the one side of all of the conductor patterns in the predetermined region is greater than the number of the one or more insulating base members arranged on the other side of all of the conductor patterns in the predetermined region.
6. The manufacturing method of the printed board as set forth in claim 4 , wherein
in the laminating step, the laminate is formed so that:
the insulating base members arranged in the another region each have a first thickness;
the one or more insulating base members arranged on the one side of all of the conductor patterns in the predetermined region each have a second thickness;
the one or more insulating base members arranged on the other side of all of the conductor patterns in the predetermined region each have the first thickness; and
the second thickness is greater than the first thickness.
7. The manufacturing method of the printed board as set forth in claim 4 , wherein
in the laminating step, the laminate is formed so that:
the insulating base members arranged in the another region each have a first thickness;
the one or more insulating base members arranged on the one side of all of the conductor patterns in the predetermined region each have the first thickness;
the one or more insulating base members arranged on the other side of all of the conductor patterns in the predetermined region each have a second thickness;
the second thickness is less than the first thickness.
8. A manufacturing method of a printed board that has a permanently-bent part, the manufacturing method comprising:
a preparing step for preparing a plurality of insulating base members, each being a film, the insulating base members being formed of, at least, a resin material, and the preparing step including forming conductor patterns on surfaces of the insulating base members;
a laminating step for laminating the insulating base members to form a laminate; and
a heat-and-pressure applying step for applying heat and pressure to the laminate to integrate the insulating base members into one piece and then releasing the pressure applied to the laminate and cooling the laminate,
wherein
all of the insulating base members prepared in the preparing step are formed of the same resin material,
in the laminating step, the laminate is formed so that: in a predetermined region of the laminate which is to constitute the permanently-bent part, there is arranged only one of the conductor patterns and one or more of the insulating base members are arranged on each of one side and the other side of the only one of the conductor patterns in the predetermined region in a lamination direction of the insulating base members, and a total thickness of the one or more insulating base members arranged on the one side of the only one of the conductor patterns in the predetermined region is larger than a total thickness of the one or more insulating base members arranged on the other side of the only one of the conductor patterns in the predetermined region,
in the heat-and-pressure applying step, the predetermined region is bent, with the one side of the only one of the conductor patterns in the predetermined region being an inner side of the bending, during the cooling by a contraction force generated in the one or more insulating base members on the one side of the only one of the conductor patterns in the predetermined region that is larger than a contraction force generated in the one or more insulating base members on the other side of the only one of the conductor patterns in the predetermined region,
the predetermined region constitutes the entirety of the permanently-bent part of the printed board and the total thickness of the one or more insulating base members arranged on the one side of the only one of the conductor patterns throughout the entirety of the predetermined region is larger than the total thickness of the one or more insulating base members arranged on the other side of the only one of the conductor patterns throughout the entirety of the predetermined region, and
each of the one or more insulating base members has a constant thickness.
9. The manufacturing method of the printed board as set forth in claim 8 , wherein in the laminating step, the laminate is formed so that the number of the one or more insulating base members arranged on the one side of the only one of the conductor patterns in the predetermined region is greater than the number of the one or more insulating base members arranged on the other side of the only one of the conductor patterns in the predetermined region.
10. The manufacturing method of the printed board as set forth in claim 9 , wherein each of the insulating base members prepared in the preparing step have the same individual thickness.
11. The manufacturing method of the printed board as set forth in claim 8 , wherein in the laminating step, the laminate is formed so that the number of the insulating base members laminated in another region, which is at a different position from the predetermined region, is greater than the number of the insulating base members laminated in the predetermined region.
12. The manufacturing method of the printed board as set claim 11 , wherein the insulating base members prepared in the preparing step each have a predetermined thickness, and
in the laminating step, the laminate is formed so that:
the number of the one or more insulating base members arranged on the one side of the only one of the conductor patterns in the predetermined region is greater than the number of the one or more insulating base members arranged on the other side of the only one of the conductor patterns in the predetermined region.
13. The manufacturing method of the printed board as set claim 11 , wherein
in the laminating step, the laminate is formed so that:
the insulating base members arranged in the another region each have a first thickness;
the one or more insulating base members arranged on the one side of the only one of the conductor patterns in the predetermined region each have a second thickness;
the one or more insulating base members arranged on the other side of the only one of the conductor patterns in the predetermined region each have the first thickness; and
the second thickness is greater than the first thickness.
14. The manufacturing method of the printed board as set forth in claim 11 , wherein
in the laminating step, the laminate is formed so that:
the insulating base members arranged in the another region each have a first thickness;
the one or more insulating base members arranged on the one side of the only one of the conductor patterns in the predetermined region each have the first thickness;
the one or more insulating base members arranged on the other side of the only one of the conductor patterns in the predetermined region each have a second thickness;
the second thickness is less than the first thickness.